Wafer Bonding Alignment via Stationary Mark Reader and Reflection Apparatus
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Solution Overview
Problem
In semiconductor wafer bonding, achieving accurate alignment is critical for high yield, but existing methods often require complex camera systems that increase cost and reduce alignment accuracy due to the need for extensive transverse movement.
Innovation Solution
A device and method utilizing a reflection apparatus and a mark reader to align wafers by reading position information from alignment marks on both wafers, eliminating the need for the mark reader to move and allowing only slight wafer movement, thus enhancing stability and accuracy while reducing costs by using a single mark reader.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If complex camera systems are used for wafer alignment, then alignment coverage is improved, but alignment accuracy deteriorates due to extensive transverse movement requirements
Solution Approach 1:
A reflection apparatus is introduced as an intermediary between the mark reader and the wafers. The mark reader remains stationary while the reflection apparatus moves with the wafers, enabling the mark reader to read alignment marks on both first and second wafers without requiring extensive transverse movement of the mark reader itself
Solution Approach 2:
Instead of moving the mark reader to read alignment marks on multiple wafers (conventional approach), the patent inverts the approach by keeping the mark reader stationary and moving the reflection apparatus that carries the alignment marks or reflects light from them, thereby achieving alignment without extensive transverse movement of the reading device
2Adaptability or versatility
If extensive transverse movement is performed for alignment, then alignment coverage is improved, but system stability deteriorates
Solution Approach 1:
The patent inverts the conventional approach by keeping the mark reader stationary and moving only the wafer and reflection apparatus. This inversion eliminates the need for extensive transverse movement of the reading device, thereby maintaining system stability while still achieving alignment of multiple wafers
3Adaptability or versatility
If multiple mark readers are used to read alignment marks on both wafers, then alignment coverage is improved, but device complexity and cost increase
Solution Approach 1:
A reflection apparatus serves as an intermediary that enables a single mark reader to read alignment marks on both first and second wafers. The reflection apparatus moves with the wafers while the mark reader remains stationary, eliminating the need for multiple mark readers or complex multi-reader coordination systems
Solution Approach 2:
The reflection apparatus performs multiple functions: it moves with the wafers during bonding, reflects light from alignment marks to the stationary mark reader, and enables a single mark reader to service multiple wafers. This multi-functionality eliminates the need for separate reading devices for each wafer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the stability and accuracy of wafer alignment without the need for extensive wafer movement, reducing costs and ensuring precise alignment for effective semiconductor bonding.
Implementation Method 1
The mark reader reads position information of the first alignment mark and the second alignment mark using the reflection apparatus
Data Source
AI summary
A device for wafer bonding alignment includes: a first fixing apparatus, configured to fix a first wafer, a first alignment mark being disposed on the first wafer; a second fixing apparatus, configured to fix a second wafer, a second alignment mark being disposed on the second wafer, the second fixing apparatus being disposed opposite to the first fixing apparatus; a reflection apparatus, located between the first fixing apparatus and the second fixing apparatus; and a mark reader, reading position information of the first alignment mark and the second alignment mark using the reflection apparatus to align the first wafer fixed on the first fixing apparatus and the second wafer fixed on the second fixing apparatus.