Wafer Bonding Calibration via Linear Pin Force and Mark Detection
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Solution Overview
Problem
Conventional wafer bonding processes often experience deviations between measured and actual bonding forces, leading to insufficient or excessive bonding, which decreases the yield rate due to inaccuracies in force application.
Innovation Solution
A calibration apparatus and method using a stage, linear moving pin, and detector to apply force to a wafer with a predetermined mark, detecting the mark's position and corresponding force, and comparing these with calibration information to generate a calculated value, allowing for precise calibration of the wafer bonding apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional wafer bonding process is used, then wafer bonding can be performed, but the measured bonding force deviates from the actual bonding force, leading to insufficient or excess bonding
Solution Approach 1:
The system performs preliminary calibration before actual wafer bonding by applying known calibration forces to the wafer and measuring the corresponding wafer surface deformation using optical interferometry. This preliminary action establishes a calibration curve that maps measured forces to actual forces, which is then used to correct force measurements during subsequent bonding operations.
Solution Approach 2:
The system implements a feedback mechanism where the measured wafer surface deformation is compared against the calibration curve to determine the actual bonding force. This feedback loop allows the system to compensate for measurement deviations and adjust the applied force to achieve the desired bonding amount, thereby improving both measurement precision and manufacturing precision.
2Productivity
If the difference between measured and actual bonding force exceeds threshold, then bonding process can be completed, but yield rate decreases due to insufficient or excess bonding amount
Solution Approach 1:
The system continuously monitors the wafer surface deformation during bonding and compares it against the calibration data to determine the actual bonding force. When the actual force deviates from the target force, the system provides feedback to adjust the applied force, ensuring consistent bonding quality and high yield rate while maintaining process reliability.
Solution Approach 2:
The system changes the bonding process parameters dynamically by adjusting the applied force based on real-time measurements and calibration data. This parameter adjustment ensures that the actual bonding force remains within the optimal range, preventing both insufficient and excess bonding, thereby improving yield rate and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise control of the bonding force, increasing the yield rate of the wafer bonding process by ensuring accurate bonding amounts, thereby improving the overall efficiency of the process.
Implementation Method 1
The linear moving pin is configured to push the wafer away from the stage
Implementation Method 2
The detector is configured to detect a position of the predetermined mark when the linear moving pin applies a force to the wafer
Implementation Method 3
the main surfaces of the wafers may move close to each other by applying forces to the wafers
Data Source
AI summary
An apparatus configured to calibrate a wafer bonding apparatus includes a stage, a linear moving pin, a detector, and a data processing unit. The stage is configured to hold a wafer thereon, and the wafer includes a predetermined mark thereon. The linear moving pin is configured to push the wafer away from the stage. The detector is configured to detect a position of the predetermined mark when the linear moving pin applies a force to the wafer. The data processing unit receives information on the position of the predetermined mark from the detector and information on a corresponding force applied to the wafer by the linear moving pin, where the data processing unit is configured to compare the information with calibration information.