Wafer Bonding Alignment Mechanism Using Cam-Actuated Pins
Solution Overview
Problem
The existing alignment mechanisms of bonding machines suffer from poor accuracy and low alignment efficiency, which negatively impact the yield rate and efficiency of the wafer and carrier substrate bonding process, particularly for thin wafers that are prone to warping or breaking.
Innovation Solution
An alignment mechanism utilizing cams to drive alignment pins, which transition between an open state and an alignment state to accurately position the wafer and carrier substrate, allowing for precise alignment and bonding without the need for multiple detectors, thereby improving alignment efficiency and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If general alignment mechanism is used, then device complexity is reduced, but alignment precision and alignment efficiency deteriorate
Solution Approach 1:
The patent replaces complex optical detection systems with a purely mechanical alignment mechanism. The cam-actuated alignment pins provide direct mechanical positioning of substrates, eliminating the need for multiple detectors and complex sensing systems. This mechanical substitution achieves high alignment precision while reducing device complexity and cost.
Solution Approach 2:
The alignment mechanism uses the substrates' own physical features (edges, surfaces) as reference points for alignment. The alignment pins directly contact and position the substrates based on their geometry, allowing the substrates to serve as their own alignment references without requiring external detection systems.
2Manufacturing precision
If multiple detectors are installed, then alignment precision improves, but device complexity and cost increase
Solution Approach 1:
The patent replaces complex optical detection systems with a purely mechanical alignment mechanism. The cam-actuated alignment pins provide direct mechanical positioning of substrates, eliminating the need for multiple detectors and complex sensing systems. This mechanical substitution achieves high alignment precision while reducing device complexity and cost.
3Productivity
If traditional alignment method is used, then device complexity is reduced, but alignment efficiency and productivity deteriorate
Solution Approach 1:
The alignment pins are pre-positioned by the cam mechanism before substrate placement. The cams are designed with specific profiles that automatically position the alignment pins at the correct locations and orientations, preparing the alignment system in advance for rapid substrate positioning without requiring complex real-time adjustments.
Solution Approach 2:
The alignment mechanism uses dynamic cam rotation to actively control the position and orientation of alignment pins during substrate handling. The cam profile converts rotational motion into precise linear displacement of the alignment pins, enabling rapid and accurate positioning that adapts to different substrate requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed alignment mechanism enhances the accuracy and efficiency of wafer and carrier substrate alignment, improving the overall process yield and reducing the need for costly sensor installations, while ensuring reliable bonding of fragile thinned wafers.
Implementation Method 1
a cam (151), used to drive the alignment pin (131) to move horizontally through conversion of rotational motion into linear displacement
Data Source
AI summary
The present disclosure is an alignment mechanism of a bonding machine, in particular an alignment mechanism of a wafer bonding machine, which mainly has a support pedestal, at least three first alignment pins, and at least three second alignment pins, a first cam and a second cam. When the first cam rotates relative to the support pedestal, it will drive the first alignment pin to move relative to the support pedestal to position the first substrate on the support pedestal. When the second cam rotates relative to the support pedestal, it drives the second alignment pin to move relative to the support pedestal to position the second substrate above the first substrate, so that the second substrate is aligned with the first substrate to facilitate bonding the first substrate and the second substrate.