Temporary Wafer Bonding Layers for Heat-Resistant Clean Separation
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Solution Overview
Problem
Existing bonding arrangements for thin wafer manufacturing are inadequate in providing a uniform thickness, heat resistance, and preventing particle generation during the separation of wafers from supports, which hampers the productivity and quality of thin wafers in semiconductor processing.
Innovation Solution
A composite temporary bonding arrangement comprising a non-silicone thermoplastic resin layer, a thermosetting silicone polymer layer, and a thermosetting siloxane-modified polymer layer, with an antistatic agent incorporated in the latter two layers, facilitates a strong and uniform bond that withstands thermal processing and allows easy separation without particle generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a protective tape based on organic resin film is attached to prevent wafer breakage during grinding, then the wafer is protected from breakage, but the protective tape has insufficient strength and heat resistance to withstand TSV forming and interconnect formation steps
Solution Approach 1:
The bonding arrangement is divided into multiple functional layers: a first bonding layer (adhesive layer) that provides strong bonding and heat resistance for TSV forming, and a second bonding layer (protective tape) that provides mechanical protection during grinding. Each layer is optimized for its specific function, resolving the contradiction between protection during grinding and reliability during high-temperature processing.
Solution Approach 2:
The first bonding layer acts as an intermediary between the wafer and the second bonding layer, providing the necessary adhesive strength and heat resistance that the protective tape alone cannot provide. This intermediary layer enables the system to withstand both grinding forces and high-temperature TSV forming processes.
2Reliability
If a temporary adhesive layer is used to bond substrate to support for withstanding grinding and TSV forming, then the system can withstand subsequent steps, but the adhesive layer may form particles upon separation that contaminate equipment
Solution Approach 1:
The bonding arrangement uses a composite structure with a first bonding layer (adhesive layer) and a second bonding layer (protective tape). This composite material system combines the bonding durability of adhesive materials with the clean separation properties of the protective tape, reducing particle generation during separation while maintaining bonding reliability during processing.
Solution Approach 2:
The second bonding layer (protective tape) is designed to be discarded during separation, taking with it any residual adhesive material. This prevents adhesive particles from contaminating the wafer and equipment, while the first bonding layer remains on the wafer to provide the necessary bonding function throughout processing.
3Ease of operation
If the wafer is released from support by mechanical peeling via interfacial or cohesive failure of the temporary adhesive agent, then separation is relatively simple, but the adhesive agent forms particles upon separation that contaminate equipment
Solution Approach 1:
The second bonding layer (protective tape) serves as an intermediary that facilitates clean separation. When mechanical peeling is performed, the protective tape detaches with minimal resistance, and any adhesive material is carried away with the tape rather than forming particles on the wafer or equipment surfaces.
4Manufacturing precision
If conventional adhesive layers are used to form uniform thickness on heavily stepped substrate, then complete bond to support is achieved, but the adhesive layer lacks heat resistance for high-temperature processing
Solution Approach 1:
The bonding arrangement segments the bonding function into two layers: the first bonding layer (adhesive layer) that ensures uniform thickness and complete bond on stepped substrates, and the second bonding layer (protective tape) that provides thermal protection. This segmentation allows each layer to be optimized for its specific function without compromise.
Solution Approach 2:
The composite structure combines an adhesive layer optimized for bonding uniformity with a protective tape layer optimized for heat resistance. This composite material system achieves both uniform thickness formation on heavily stepped substrates and sufficient heat resistance for high-temperature processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the formation of thin wafers with uniform thickness and high heat resistance, preventing particle contamination and enhancing productivity by ensuring efficient separation and handling of fragile wafers.
Implementation Method 1
a thermosetting silicone polymer layer, and a thermosetting siloxane-modified polymer layer
Implementation Method 2
with an antistatic agent incorporated in the latter two layers, facilitates a strong and uniform bond that withstands thermal processing and allows easy separation without particle generation
Data Source
Figure 1
AI summary
A bonding arrangement (2) comprising a silicone-base adhesive composition is suited for temporarily bonding a wafer (1) to a support (3) for wafer processing. The bonding arrangement includes a first temporary bond layer (A) of non-silicone thermoplastic resin, and a second temporary bond layer (B) of thermosetting silicone polymer and/or a third temporary bond layer (C) of thermosetting siloxane-modified polymer. The second and/or third bond layer contains an antistatic agent.