Wafer Bonding System In-Situ Defect Detection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor wafer bonding technologies are inadequate in monitoring alignment performance in-situ, leading to manufacturing yields and cycles being adversely affected due to undesired gaps or voids and misalignment issues.
Innovation Solution
A wafer bonding system incorporating a movable imaging device with a radiation source and image sensor for real-time inspection of bonding defects across the bonding interface, allowing for in-situ detection and correction of alignment errors and voids during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional wafer bonding methods are used without in-situ monitoring, then the bonding process is simpler and faster, but alignment precision and detection of bonding defects deteriorate
Solution Approach 1:
The patent introduces an intermediary imaging device (camera) and radiation source as a mediator between the bonding process and the operator. This device captures images of the bonding interface to provide alignment information and defect detection without requiring direct human observation, thus improving measurement precision while managing system complexity through automated imaging.
Solution Approach 2:
The patent implements feedback by using the imaging device to capture real-time images of the bonding interface, processing these images to determine alignment accuracy and detect defects, and using this information to guide adjustments during the bonding process. This closed-loop feedback system improves alignment precision while the automation of image processing helps manage system complexity.
2Reliability
If traditional wafer bonding methods are used without in-situ monitoring, then the equipment is simpler, but manufacturing yield deteriorates due to undetected bonding defects
Solution Approach 1:
The patent applies preliminary action by performing image capture and defect detection during the bonding process itself, before the bonding is completed and the wafers are removed. This allows alignment errors and bonding defects to be detected and corrected while there is still time to take corrective action, thereby improving manufacturing yield without requiring entirely separate inspection equipment.
Solution Approach 2:
The imaging system provides real-time feedback on bonding quality, allowing operators to detect defects and alignment issues during the process and make corrections before final bonding completion. This feedback mechanism improves reliability by ensuring defects are caught early, while the integration of imaging capabilities into the existing bonding system helps manage complexity.
3Productivity
If traditional wafer bonding methods are used without in-situ monitoring, then the process cycle is shorter, but productivity deteriorates due to rework and lower yields
Solution Approach 1:
The patent maintains continuity of useful action by performing imaging and defect detection during the bonding process itself, rather than requiring separate inspection steps after bonding. The imaging device operates concurrently with the bonding process, allowing alignment verification and defect detection to occur without interrupting the bonding sequence, thus improving productivity while minimizing additional time investment.
Solution Approach 2:
By performing alignment verification and defect detection during the bonding process itself, the system catches issues early when corrective action is still possible. This preliminary detection prevents the need for time-consuming rework or complete process repetition, thereby improving manufacturing efficiency without significantly extending the bonding cycle time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables efficient detection and correction of bonding defects, reducing the bonding failure rate and yield loss by allowing for real-time monitoring and in-situ rework, thereby improving manufacturing efficiency.
Implementation Method 1
A radiation source of the imaging device is configured to emit radiation, and an image sensor of the imaging device is configured to receive the radiation
Implementation Method 2
an image sensor of the imaging device is configured to receive the radiation
Data Source
AI summary
A method of semiconductor wafer bonding and system thereof are proposed. A first alignment mark of a first semiconductor wafer is aligned with a second alignment mark of a second semiconductor wafer. A partial attachment is performed between the first semiconductor wafer and the second semiconductor wafer. A scanning is performed along a direction substantially parallel to a surface of the first semiconductor wafer. It is determined if a bonding defect of the partially attached first semiconductor wafer and the second semiconductor wafer exists.