Wafer Bonding Device Without Spacers
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Solution Overview
Problem
Existing wafer bonding methods using spacers result in gaps on the contact surface and risk of wafer slippage during alignment, leading to inaccurate bonding.
Innovation Solution
A device and method that apply a bonding agent to the wafer surfaces, allowing contact without spacers, using a control unit for precise alignment and bonding, eliminating the need for spacers and ensuring accurate alignment by sliding and rotating the wafers along their surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spacers are used to maintain separation distance during alignment, then alignment stability is improved, but gaps are formed on the contact surface and the risk of wafer slippage increases
Solution Approach 1:
The invention removes spacers from the bonding process entirely. Instead of using spacers to maintain separation distance, the method applies bonding agent directly to the wafer surfaces and brings them into contact without any intermediate spacer elements, thereby eliminating both gaps and slippage risks
Solution Approach 2:
The bonding agent is applied to the wafer surfaces before contact is made. This preliminary application of bonding agent allows the surfaces to be brought into direct contact without requiring spacers for separation maintenance, as the bonding agent itself manages the interface between surfaces
2Stability of the object's composition
If spacers are distributed on wafer circumferences to ensure stable hold, then wafer positioning stability is improved, but the contact surface area is reduced due to gaps
Solution Approach 1:
Spacers are completely removed from the process. The invention achieves wafer positioning stability through direct surface contact with bonding agent rather than through discrete spacer elements, thereby maximizing the contact surface area
Solution Approach 2:
The functions of spacer distribution and bonding are merged into a single direct surface contact process. The bonding agent is applied across the entire contact surface, combining the positioning and bonding functions that were previously separated into spacer placement and surface contact
3Manufacturing precision
If spacers are withdrawn uniformly during contacting, then wafer alignment is maintained, but slippage risk increases due to loss of stable hold
Solution Approach 1:
The invention eliminates the spacer withdrawal step entirely by not using spacers. Wafers are brought into direct contact with bonding agent applied beforehand, removing the slippage risk associated with spacer removal while maintaining alignment precision
Solution Approach 2:
Bonding agent is applied to wafer surfaces before contact is made. This preliminary action ensures that when surfaces are brought into contact, the bonding agent provides immediate adhesion, preventing slippage without requiring spacer withdrawal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves precise alignment and bonding without gaps, enhancing the quality of the bonded wafers by eliminating slippage and allowing full-surface adhesion, resulting in improved accuracy and reduced risk of misalignment.
Implementation Method 1
A layer of bonding agent is applied to at least one of the corresponding surfaces by means of the unit
Implementation Method 2
Good results are achieved, for example, with UV-curable epoxy resin adhesives
Data Source
AI summary
The invention relates to a device and a corresponding method for bonding wafers along their corresponding surfaces.