Wafer Bonding Alignment Using Holder Inclination Measurement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for bonding semiconductor wafers face reduced precision and yield due to misalignment of substrates, which affects the bonding quality.
Innovation Solution
A bonding apparatus equipped with a first holder, a second holder, a horizontally moving unit, an elevating unit, and an inclination measuring unit, controlled by a controller to accurately align and position substrates based on inclination measurements, ensuring precise bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding methods are used without inclination measurement, then the bonding process is simpler, but substrate misalignment occurs reducing bonding precision
Solution Approach 1:
The patent replaces complex mechanical alignment mechanisms with an optical/electronic inclination measurement system. The inclination measuring unit detects substrate tilt angles, and the controller automatically calculates and adjusts positions, substituting manual or mechanical alignment methods with automated optical-electronic control to achieve higher precision without proportionally increasing mechanical complexity
Solution Approach 2:
The system performs self-alignment by automatically measuring inclination, calculating position deviations, and adjusting substrate positions without external intervention. The controller uses the inclination measurement data to autonomously determine the second substrate's position and execute correction, enabling the bonding apparatus to self-correct alignment errors
2Productivity
If substrate position is not accurately calculated based on inclination, then the alignment process is faster, but bonding yield decreases due to misalignment
Solution Approach 1:
The inclination measurement is performed before the bonding operation to predict and prevent misalignment. By measuring the inclination in advance and calculating the position deviation beforehand, the system prepares correction data that enables accurate positioning during the actual bonding process, ensuring high yield without time loss during alignment
Solution Approach 2:
The system implements a feedback loop where the inclination measuring unit continuously monitors substrate orientation, the controller processes this data to calculate position deviations, and the system adjusts substrate positions accordingly. This closed-loop feedback mechanism ensures real-time alignment correction, maintaining high bonding yield while minimizing alignment time through iterative optimization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves bonding precision and yield by accurately calculating and adjusting the position of substrates, enhancing the alignment process and resulting bond quality between semiconductor wafers.
Implementation Method 1
a first holder (400) that attracts and holds a first substrate (W1) on a bottom surface
Implementation Method 2
a second holder (500) that attracts and holds, on a top surface, a second substrate (W2) to be bonded to the first substrate
Implementation Method 3
bonding target surfaces of the substrates are modified, the modified surfaces of the substrates are hydrophilized, and the hydrophilized substrates are bonded by a Van der Waals force and a hydrogen bond
Implementation Method 4
bonding target surfaces of the substrates are modified, the modified surfaces of the substrates are hydrophilized, and the hydrophilized substrates are bonded by a Van der Waals force and a hydrogen bond
Data Source
AI summary
A bonding apparatus includes a first holder; a second holder; a horizontally moving unit; an elevating unit; an inclination measuring unit; and a controller. The first holder is configured to attract and hold a first substrate on a bottom surface thereof. The second holder is disposed under the first holder and configured to attract and hold a second substrate on a top surface thereof. The horizontally moving unit is configured to move the first substrate and the second substrate relative to each other in a horizontal direction. The elevating unit is configured to move the second substrate up and down between a proximate position and a spaced position. The inclination measuring unit is configured to measure an inclination of the second holder. The controller calculates a position of the second substrate in the horizontal direction based on a measurement result of the inclination measuring unit.