Wafer Bonding Apparatus Central Portion Protrusion Control
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Solution Overview
Problem
Existing bonding apparatuses face challenges in achieving precise and efficient bonding between substrates, particularly in aligning and contacting the central portions of wafers to ensure uniform bonding across the entire surface, which affects bonding precision and substrate alignment.
Innovation Solution
A bonding apparatus is configured with a first and second holder, a moving unit, and transforming units to control the relative positions and protrusions of substrates, allowing the central portions of the wafers to be precisely aligned and contacted, with the controller adjusting the protruding amounts to optimize contact and bonding precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the central portion of the upper wafer is transformed downwards to contact the central portion of the lower wafer, then the contact regions are enlarged from central portions toward peripheral portions, but bonding precision and substrate alignment are affected due to deviations in the bonding process
Solution Approach 1:
The patent applies preliminary action by transforming the central portions of both wafers protrudingly before the bonding contact. The first transforming unit makes the central portion of the upper wafer protrude downward, and the second transforming unit makes the central portion of the lower wafer protrude upward in advance. This preliminary transformation ensures that the central portions align and contact precisely at predetermined positions, preventing alignment deviations during the bonding process and enabling accurate bonding across the entire wafer surface.
2Manufacturing precision
If the protruding amount of the central portion is controlled to optimize contact, then bonding precision is enhanced, but device complexity increases due to multiple transforming units and controllers
Solution Approach 1:
The patent applies local quality by focusing the transformation action specifically on the central portions of the wafers rather than the entire wafer surfaces. The first transforming unit and second transforming unit are configured to make only the central portions protrude, while the peripheral portions remain held by the holders. This localized transformation approach achieves precise bonding contact with controlled complexity, as the transforming units only need to act on specific central regions rather than the entire wafer area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances bonding precision by ensuring accurate alignment and contact between substrates, reducing deviations and improving the uniformity of the bonding process, thereby increasing the overall quality of the bonded substrate.
Implementation Method 1
a first holder configured to attract and hold the first substrate from above, a second holder provided below the first holder and configured to attract and hold the second substrate from below
Data Source
AI summary
A bonding apparatus includes a first holder, a second holder, a moving unit, a first transforming unit, a second transforming unit and a controller. The first holder holds a first substrate from above. The second holder is provided below the first holder, and holds a second substrate from below. The moving unit moves the first holder and the second holder relative to each other. The first transforming unit makes a central portion of the first substrate held by the first holder protruded downwards. The second transforming unit makes a central portion of the second substrate held by the second holder protruded upwards. The controller performs a control of bringing the central portions into contact with each other. The controller performs a control of changing a protruding amount of the central portion of the first substrate according to a protruding amount of the central portion of the second substrate.