Wafer Bonding Yield via Rule Checks and Feedback
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Solution Overview
Problem
Current wafer bonding processes are manually controlled and do not consider wafer defects, leading to low yields in bonded products.
Innovation Solution
A method and system for wafer bonding that involves providing a bonding relation between wafer lots, acquiring basic information, performing rule checks, and updating information to ensure qualified bonding, including predicting post-bonding yield and checking fabrication processes to ensure accurate bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual controlled bonding procedure is used, then operation simplicity is maintained, but bonding yield deteriorates due to inability to detect wafer defects
Solution Approach 1:
The system performs preliminary actions by acquiring wafer information and performing rule checks before the actual bonding operation. Multiple rule checks (first rule check, second rule check) are conducted in advance to identify potential defects and determine appropriate bonding strategies, ensuring that only suitable wafers proceed to bonding, thereby improving yield without adding complexity to the bonding operation itself.
Solution Approach 2:
The system implements feedback mechanisms by continuously acquiring wafer information, performing rule checks on the acquired information, and adjusting bonding decisions based on the check results. The bonding determination module uses feedback from rule check outcomes to determine whether to perform bonding, modify bonding parameters, or reject wafers, creating a closed-loop control system that improves bonding quality.
2Manufacturing precision
If multiple rule checks and information updates are performed, then bonding quality is improved, but processing time increases
Solution Approach 1:
Multiple rule checks are performed in advance before the actual bonding operation to identify and resolve potential quality issues early in the process. The first rule check and second rule check are conducted sequentially before bonding determination, allowing time-consuming quality assessments to be completed beforehand rather than during or after bonding, thus minimizing the time impact on the critical bonding operation.
Solution Approach 2:
The system implements conditional skipping by performing rule checks and bonding operations selectively based on wafer quality assessment. If wafers pass the rule checks with high confidence, the system can proceed directly to bonding without unnecessary delays. The automated nature of the rule checks allows rapid processing of quality criteria, skipping lengthy manual inspection steps while maintaining high bonding quality standards.
Data Source
AI summary
Implementations of the present disclosure provides a wafer bonding method and system. The method comprises: providing a bonding relation which is used to indicate bonding between at least two wafer lots; acquiring basic information of wafer lots corresponding to the bonding relation according to the bonding relation; performing a first rule check on the basic information, and conveying the wafer lots to a bonding station after the check passes; updating the basic information of the wafer lots conveyed to the bonding station to obtain updated basic information; performing a second rule check on the updated basic information, and performing wafer bonding on the wafer lots conveyed to the bonding station according to the bonding relation after the check passes.