Wafer Bonding Strength Measurement Apparatus
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Solution Overview
Problem
Current methods for measuring wafer bonding strength, such as the crack opening method, are limited by factors like peripheral environments and indirect measurement techniques, leading to inaccuracies and difficulties in comparing results across different methods.
Innovation Solution
An apparatus comprising a wafer fixer and a measuring unit with a blade, driver, and sensor that directly measures the force required to separate bonded wafers, providing a more accurate and precise assessment of bonding strength by determining the maximum blade force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the crack opening method is used to measure wafer bonding strength, then the measurement can be performed, but the accuracy is reduced due to indirect measurement and sensitivity to peripheral environments
Solution Approach 1:
The patent replaces the indirect optical measurement system with a direct mechanical measurement system. A force sensor directly measures the separation force applied to the bonded wafers, substituting the crack opening method's optical field-based indirect measurement. This mechanical substitution eliminates sensitivity to peripheral environmental factors like temperature and humidity that affect optical measurements, providing direct force data that accurately reflects bonding strength.
2Measurement precision
If the crack opening method is used, then wafer bonding strength can be inferred, but the measurement is indirect and affected by multiple factors
Solution Approach 1:
The patent extracts and measures only the essential parameter - the separation force - directly at the bonding interface. By removing the intermediate steps of crack generation and optical measurement, the invention directly measures the force required to separate bonded wafers using a force sensor. This extraction of the core measurement parameter simplifies the measurement process and eliminates the complexity of indirect optical measurement systems while improving accuracy.
3Reliability
If indirect measurement methods are used, then measurement can be performed, but precision and reliability are reduced
Solution Approach 1:
The patent replaces indirect optical measurement systems with a direct mechanical force measurement system. A force sensor is positioned to directly measure the separation force applied to the bonded wafers, providing reliable and precise data. This mechanical measurement approach eliminates the reliability issues associated with indirect optical methods, such as sensitivity to environmental conditions and complex data interpretation, while maintaining high measurement precision through direct force detection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the accuracy and precision of wafer bonding strength measurement by directly measuring the force required to separate wafers, reducing the impact of external factors and allowing for more reliable comparisons with other methods.
Implementation Method 1
The sensor may measure the force applied to the blade
Data Source
AI summary
An apparatus for measuring wafer bonding strength may include a wafer fixer and measuring unit. The wafer fixer may be configured to fix bonded wafers. The measuring unit may be configured to measure bonding strength of the bonded wafers. The measuring unit may include a blade, a driver and a sensor. The blade may apply a force to an interface between the bonded wafers to separate the bonded wafers from each other. The driver may provide the blade with a driving force. The sensor may measure the force applied to the blade.