Wafer Bonding Apparatus with Substrate Detection for Uniform Expansion
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Solution Overview
Problem
Current bonding systems for semiconductor wafers lack the ability to monitor and control the uniform expansion of the bonding wave, leading to potential distortion in laminated wafers due to uneven bonding processes.
Innovation Solution
A bonding apparatus equipped with substrate detection parts that monitor the detachment of substrates and control the suction timings to ensure uniform bonding wave expansion, using a pressing member to bring the central portions of the substrates into contact and expand the bonding area concentrically.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding system is used without substrate detection parts, then the bonding process is simple, but the bonding wave expansion cannot be monitored leading to uneven bonding and wafer distortion
Solution Approach 1:
The bonding apparatus incorporates substrate detection parts that detect the detachment state of substrates from the holding part during bonding. This detection information is fed back to the control part, which adjusts the suction force applied to different regions of the substrate. By dynamically adjusting suction force based on real-time detection feedback, the system ensures uniform bonding wave expansion while maintaining a relatively simple overall structure.
2Manufacturing precision
If uniform bonding wave expansion is achieved through detection and control, then wafer distortion is reduced, but the bonding process time increases due to monitoring and adjustment
Solution Approach 1:
The substrate detection parts automatically detect the bonding wave expansion state and provide information to the control part without requiring external intervention. The system self-regulates by automatically adjusting suction force distribution based on detected detachment patterns, eliminating the need for manual monitoring and adjustment while ensuring uniform bonding.
3Manufacturing precision
If suction force is uniformly applied across the substrate, then the apparatus operation is simple, but the bonding wave expands unevenly causing distortion
Solution Approach 1:
The holding part is divided into multiple suction regions with independently controllable suction forces. The control part adjusts the suction force in each local region based on detection information from substrate detachment states. This localized control ensures that suction force is optimized for each specific area, achieving uniform concentric bonding wave expansion while maintaining straightforward operational control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the detection and control of the bonding wave, ensuring a uniform bonding process and reducing distortion in laminated wafers, thereby improving the yield and quality of wafer bonding.
Implementation Method 1
a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate
Implementation Method 2
a pressing member provided in the first holding part and configured to press a central portion of the first substrate
Implementation Method 3
the wafers are bonded to each other by virtue of a van der Waals force and a hydrogen bond (intermolecular force)
Implementation Method 4
the wafers are bonded to each other by virtue of a van der Waals force and a hydrogen bond (intermolecular force)
Data Source
AI summary
There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.