Wafer Bonding Alignment With Temperature-Based Position Correction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional bonding apparatuses face challenges in accurately aligning and bonding semiconductor wafers due to thermal expansion and contraction, leading to reduced positional accuracy and bonding precision.
Innovation Solution
A bonding apparatus equipped with a temperature detector and controller that adjusts the horizontal position of substrates based on imaging results and temperature corrections, ensuring precise alignment and bonding through a combination of imaging devices, adjusting devices, and temperature detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal expansion and contraction occur during substrate bonding, then the bonding process can proceed with temperature changes, but positional accuracy and bonding precision deteriorate
Solution Approach 1:
The patent applies parameter changes by dynamically adjusting the horizontal position of substrates based on detected temperature values. The control unit modifies positioning parameters in real-time to compensate for thermal expansion and contraction, maintaining bonding precision despite temperature fluctuations during the bonding process
Solution Approach 2:
The patent implements feedback control by using temperature detectors to continuously monitor temperature changes and feeding this information back to the control unit. The control unit then adjusts the horizontal position of substrates based on this feedback, creating a closed-loop system that maintains positioning accuracy throughout the bonding process
2Manufacturing precision
If temperature detection and correction mechanisms are added to maintain positioning accuracy, then bonding precision improves, but device complexity increases
Solution Approach 1:
The control unit serves multiple functions: it controls the imaging device for initial positioning, processes temperature data from detectors, calculates position corrections, and actuates the positioning mechanism. This multi-functionality reduces the need for separate dedicated components for each function, thereby limiting the increase in device complexity while maintaining high bonding precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the accuracy of substrate alignment and bonding by compensating for thermal deviations, thereby improving the precision of semiconductor wafer bonding processes.
Implementation Method 1
thermal expansion and contraction
Data Source
AI summary
A bonding apparatus for bonding a first substrate and a second substrate includes a first holder, a second holder, an imaging device, an adjusting device, a temperature detector and a controller. The first holder holds the first substrate. The second holder holds the second substrate. The imaging device images the first substrate or the second substrate. The adjusting device adjusts a horizontal position of the first substrate or a horizontal position of the second substrate. The temperature detector detects temperatures of one or more members. The controller images the first substrate and the second substrate by using the imaging device, controls the adjusting device based on an imaging result of the imaging device to adjust the horizontal position of the first substrate or the horizontal position of the second substrate to a bonding position, and corrects the bonding position based on a detection result of the temperature detector.