Adaptive Wafer Bow Control Between Semiconductor Process Chambers
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Solution Overview
Problem
Wafer bowing during fabrication processes poses challenges in achieving uniformity and predictability in semiconductor devices, leading to reduced yields and increased complexity in managing deformation variations.
Innovation Solution
A system that includes a sensor to measure wafer bowing characteristics, a controller to determine recipe parameters for reducing wafer bow, and environmental control mechanisms to adjust conditions in the transfer chamber and processing chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fabrication processes are performed on wafers, then semiconductor devices are produced, but wafer bowing occurs leading to reduced yields and uniformity
Solution Approach 1:
The system performs preliminary measurement of wafer bowing characteristics using a sensor in the transfer chamber before the wafer enters the processing chamber. Based on these measurements, the controller pre-determines appropriate recipe parameters (such as chamber temperature, pressure, and process duration) to compensate for the measured bowing, thereby preventing yield loss before it occurs
Solution Approach 2:
The system implements a feedback loop where wafer bowing characteristics are continuously measured by the sensor, the controller analyzes these measurements to determine optimal recipe parameters, and adjusts the fabrication process accordingly. This closed-loop control ensures that wafer uniformity is maintained throughout the fabrication process
2Reliability
If wafer bowing is measured and managed, then yields and uniformity improve, but system complexity increases due to additional sensors and controls
Solution Approach 1:
The transfer chamber serves multiple functions: it acts as a transport pathway between chambers, maintains vacuum conditions, and houses the bowing sensor for measurement. By integrating the measurement function into an existing chamber, the system avoids adding separate dedicated measurement equipment, thereby reducing overall system complexity
Solution Approach 2:
The system uses the wafer's own physical characteristics (its bowing shape) as the measurement target, requiring no additional test structures or markers on the wafer. The sensor directly measures the wafer's surface profile, allowing the wafer to essentially measure itself without external assistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces wafer bow by adapting recipe parameters and environmental conditions, thereby increasing fabrication yields and ensuring uniformity and predictability in end products.
Implementation Method 1
the sensor configured to measure wafer bowing characteristics associated with a bow of the wafer
Implementation Method 2
causing the at least one inner heating zone and the at least one outer heating zone to heat to different temperatures to reduce the bow of the wafer
Implementation Method 3
the pedestal including an electrostatic chuck
Data Source
AI summary
A sensor can be configured to measure wafer bowing characteristics associated with a bow of a wafer after a first fabrication process is performed on the wafer in a first processing chamber and before a second fabrication process is performed on the wafer in a second processing chamber. A transfer chamber, including the sensor, can be coupled to a first process chamber and a second process chamber. The wafer bowing characteristics can be used by a controller to determine recipe parameters. The recipe parameters can be used by the controller to control environmental conditions in the transfer chamber and/or processing chamber and cause the processing chamber to perform its associated fabrication process using the recipe parameters.