Wafer Shipping Box Orientation in Semiconductor Stocker
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Solution Overview
Problem
Existing semiconductor fabrication line transfer systems face inefficiencies due to the lack of automatic recognition and compatibility of front open shipping boxes (FOSB) with transfer apparatuses, leading to reduced productivity and increased transfer times, as well as vulnerability to pollution when wafer shipping boxes are transferred with open doors.
Innovation Solution
A semiconductor wafer transfer system incorporating a stocker with an automated transfer robot, inlet and outlet ports, and a shelf module with support pins and reflective alignment panels to orient and secure wafer shipping boxes with their doors facing away from the body frame, ensuring compatibility and reducing exposure during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If manual loading of FOSB is used, then compatibility with transfer systems is improved, but productivity is reduced
Solution Approach 1:
The system enables automatic recognition and loading of FOSB through self-identification mechanisms. The FOSB includes identification features that allow the transfer robot to automatically recognize and handle the box without manual intervention, thereby maintaining compatibility while improving productivity
Solution Approach 2:
Manual mechanical loading operations are replaced with an automated transfer robot system. The robot uses sensors and control systems to automatically load FOSB into the stocker, eliminating the need for manual operation while maintaining system compatibility
2Productivity
If wafer shipping box is transferred with open door, then loading/unloading speed is improved, but vulnerability to pollution increases
Solution Approach 1:
The door is opened in advance before the FOSB reaches the loading position, and closed immediately after loading is complete. This preliminary action allows the door to be open only when necessary, maintaining fast transfer speed while minimizing exposure time to pollution
Solution Approach 2:
The door opening and closing operation is performed rapidly during the transfer process. The system rushes through the door opening/closing action to minimize the time the FOSB is exposed to the external environment, thereby reducing pollution vulnerability while maintaining transfer speed
3Adaptability or versatility
If multiple transfer directions are used in OHT/OHS/RGV, then flexibility is improved, but transfer time increases
Solution Approach 1:
The stocker is designed with universal inlet and outlet ports that can handle FOSB from multiple transfer systems (OHT, OHS, RGV) through a unified interface. This multi-functional design allows the stocker to accept boxes from different directions without requiring separate handling procedures, maintaining flexibility while reducing transfer time
Data Source
AI summary
A semiconductor wafer stocker apparatus includes a body frame, an inlet port to load a wafer shipping box into the body frame, an outlet port to unload the wafer shipping box from the body frame, an automated transfer robot operable to convey the wafer shipping box between the inlet port and the outlet port, and a shelf module within the body frame. The shelf module includes a shelf plate configured to support the wafer shipping box. The shelf plate includes first, second, and third protruding support pins arranged to align with respective grooves in an underside of the wafer shipping box and orient the wafer shipping box with a door thereof facing away from the body frame. The first and second support pins may be closer to the body frame than the third support pin. Related apparatus and methods of operation are also discussed.