Wafer Breaking Method for Precise Cross-Section Analysis
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Solution Overview
Problem
In semiconductor wafer analysis, wafers with a preset angle between the product line direction and crystal direction cannot be naturally broken to produce a breakage plane perpendicular or parallel to the product line direction, hindering microscopic analysis of physical properties.
Innovation Solution
A method involving forming cracks on the wafer edges and a cutting slot on the opposite surface, aligned with the target point, to break the wafer in a preset direction, ensuring the cross-section is obtained without being affected by the crystal direction, allowing for accurate analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If natural breaking method is used, then the wafer breaks along the crystal direction, but the breakage plane cannot be perpendicular or parallel to the product line direction when there is a preset angle between them
Solution Approach 1:
The method creates preliminary cracks at the edges of the wafer and forms a cutting slot before the actual breaking operation. These preliminary structures guide the breakage to occur along the desired direction rather than the natural crystal direction, enabling control over the breakage plane orientation regardless of the wafer's crystal structure.
Solution Approach 2:
The cutting slot acts as an intermediary element that mediates between the applied breaking force and the wafer material. By introducing this intermediate structure, the breaking force is directed along the slot, causing the wafer to break in the preset direction rather than following its natural crystallographic preferences.
2Productivity
If the wafer is broken directly with both hands, then the process is simple and fast, but the breakage plane direction cannot be controlled for wafers with preset angle between product line and crystal direction
Solution Approach 1:
Instead of directly breaking the wafer, the method first performs preliminary actions by creating cracks at the edges and forming a cutting slot. This preliminary preparation enables the subsequent breaking step to be both fast and precise, as the crack propagation will follow the predetermined path of least resistance created by the cutting slot.
Solution Approach 2:
The breaking process is segmented into distinct steps: creating edge cracks, forming a cutting slot, and then applying breaking force. This segmentation allows each step to be optimized independently - the cracks and slot are created with precision tools, while the final breaking can be performed quickly by hand, combining precision and speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise cross-sectional analysis of wafer samples by controlling the breakage plane direction, overcoming the limitations of natural breaking methods and facilitating effective microscopic examination.
Implementation Method 1
forming a first crack and a second crack respectively at edges of the wafer sample... forming a cutting slot in the preset direction on the second surface... breaking the wafer sample along the cutting slot
Data Source
AI summary
Embodiments of the present disclosure relate to a wafer breaking method and a chip failure analysis method. The wafer breaking method includes: providing a wafer sample, which includes a first surface with a target point and a second surface opposite to the first surface; forming a first crack and a second crack, orthographic projection of which on the first surface are on the same straight line as the target point in a preset direction; forming a cutting slot, there is a preset distance between a bottom of the cutting slot and the first surface, and orthographic projection of the first crack and the second crack are on the same straight line as the cutting slot; and breaking the wafer sample along the cutting slot, such that the wafer sample is broken in the preset direction to obtain a cross section of the target point in the preset direction.