Wafer Brush Cleaning Assembly for Cross-Contamination Control
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Solution Overview
Problem
Existing wafer cleaning methods fail to effectively remove polishing debris, particularly organic particles, and can re-contaminate the wafer due to brush contamination during the cleaning process, leading to inefficient cleaning and reduced brush lifespan.
Innovation Solution
A wafer cleaning device and method utilizing a brush assembly with movable and rotatable brushes, including a brush mover and rotator, alternately positions brushes for cleaning and cleaning themselves to prevent cross-contamination and enhance particle removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a brush is used to clean the wafer surface, then cleaning effectiveness is improved, but the brush becomes contaminated with polishing debris and re-contaminates the wafer
Solution Approach 1:
The brush assembly is divided into multiple independent brushes (first brush, second brush, third brush) that can be independently positioned and controlled. This segmentation allows different brushes to perform different functions (cleaning vs. cleaning the brush) without cross-contamination, resolving the contradiction between cleaning effectiveness and brush contamination.
Solution Approach 2:
The brush assembly incorporates movable and rotatable brushes with adjustable positions and rotation speeds. The controller dynamically adjusts brush positions and rotation based on operational requirements, enabling the system to switch between cleaning the wafer and cleaning the brushes themselves, thereby preventing re-contamination while maintaining cleaning effectiveness.
2Productivity
If the brush rotates at high speed to remove organic particles, then particle removal efficiency is improved, but brush wear increases reducing lifespan
Solution Approach 1:
The system dynamically adjusts brush rotation speeds based on operational phase. During wafer cleaning, higher rotation speeds are used to remove organic particles efficiently. During brush cleaning phases, rotation speeds are reduced or reversed to minimize wear while still achieving effective brush maintenance, thus balancing productivity and brush lifespan.
Solution Approach 2:
The brush assembly alternates between different operational states: cleaning the wafer at high speed, then cleaning itself at reduced speed, then returning to wafer cleaning. This periodic action allows the system to achieve high particle removal efficiency when needed while reducing brush wear through intermittent lower-speed operation and self-cleaning cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for effective removal of organic particles without re-contaminating the wafer, extending brush life and ensuring thorough cleaning without transferring debris back to the wafer.
Implementation Method 1
a plurality of brushes configured to clean a first surface of the wafer
Implementation Method 2
a brush mover including at least one actuator, the brush mover connected to the plurality of brushes of the first brush assembly and configured to move positions of the plurality of brushes
Data Source
AI summary
A wafer cleaning device includes: a first brush assembly on a first side of a wafer and comprising a plurality of brushes configured to clean a first surface of the wafer; a first brush cleaner configured to clean the plurality of brushes of the first brush assembly; a brush mover including at least one actuator, the brush mover connected to the plurality of brushes of the first brush assembly and configured to move positions of the plurality of brushes; and a brush rotator including at least one actuator, the brush rotator connected to the plurality of brushes of the first brush assembly and configured to rotate each of the plurality of brushes.