Wafer Cleaning Brush with Segmented Bristle Pressure Control

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Solution Overview

Problem

Conventional brushes for cleaning wafers after chemical mechanical polishing lack the ability to control pressure differentially across the wafer, leading to longer contact times with the central region, which can result in partial removal of circuit structures and particles, and inefficient particle removal at the edge regions.

Innovation Solution

A brush design featuring a brushing roller with distinct regions for central and edge areas, where first brushing bristles with a cylindrical shape apply a lower pressure to the central region and second bristles with a truncated conical shape apply a higher pressure to the edge region, ensuring efficient particle removal without damaging the central circuit structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a conventional brush with uniform brushing bristles is used, then the structure is simple and easy to manufacture, but the pressure applied to different regions of the wafer cannot be controlled, resulting in longer contact time at the edge region and potential damage to central circuit structures

Engineering Contradiction:

Improvepressure control by regionVSAvoidbrush structure

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The brushing bristles are divided into multiple groups (first brushing bristles for central region, second brushing bristles for edge region, third brushing bristles for intermediate region) with different shapes and pressure characteristics. This segmentation allows each region to receive appropriate pressure control, resolving the contradiction between operational pressure control and structural simplicity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different portions of the brush have different local qualities - the first brushing bristles have a first shape optimized for central region cleaning, the second brushing bristles have a second shape optimized for edge region cleaning, and the third brushing bristles have a third shape for intermediate regions. This local differentiation enables region-specific pressure control while maintaining an integrated brush structure.

Inventive Principle:

Principle #3Local quality

2Productivity

If the brushing bristles contact the central region for a long time to ensure particle removal, then particle removal is improved, but the circuit structure in the central region may be partially removed

Engineering Contradiction:

Improveparticle removal efficiencyVSAvoiddamage to circuit structure

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The brush segments the contact time and pressure application by region. The first brushing bristles are designed to contact the central region with controlled pressure and optimized contact time, while the second brushing bristles handle the edge region. This segmentation prevents excessive contact time at the central region that would damage circuit structures, while still achieving effective particle removal.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention changes the geometric parameters of the brushing bristles (shape, dimensions, material properties) to control the pressure and contact time characteristics. By adjusting these parameters for different brush sections, the contact time at the central region is optimized to remove particles without exceeding the threshold that would damage circuit structures.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If the brushing bristles contact the edge region for a long time to remove particles, then particle removal is improved, but the contact time at the central region becomes excessively long

Engineering Contradiction:

Improveedge region particle removalVSAvoidcentral region contact time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The brush divides the wafer surface into multiple regions with dedicated brushing bristles for each. The second brushing bristles are specifically designed for edge region contact with optimized parameters for that region, while the first brushing bristles handle the central region. This segmentation ensures that edge region particle removal does not prolong central region contact time unnecessarily.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The brush design creates dynamic pressure distribution and contact characteristics adapted to the specific needs of each region. The different shapes and dimensions of the brushing bristle groups allow the system to dynamically adjust contact time and pressure based on the local requirements of central versus edge regions during the cleaning process.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS20240148133A1Brush for cleaning a wafer

Publication Date: 2024.05.09 SAMSUNG ELECTRONICS CO LTD

AI summary

A brush for cleaning a wafer includes a core extending lengthwise in a first direction, a brushing roller arranged on an outer circumferential surface of the core and having a first region and a second region defined at an outer circumferential surface of the brushing roller, a plurality of first brushing bristles extending from the first region in a radial direction of the brushing roller, wherein the radial direction of the brushing roller is perpendicular to the first direction, and a plurality of second brushing bristles extending from the second region in the radial direction of the brushing roller. Each of the plurality of first brushing bristles has a first shape, and each of the plurality of second brushing bristles has a second shape different from the first shape.