Wafer Cleaning Brush Tilt Control Using Torque and Vibration Sensing
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Solution Overview
Problem
Existing technologies struggle to accurately adjust the tilt of a brush for cleaning wafers, leading to inconsistencies in cleaning effectiveness due to difficulties in measuring and adjusting the brush's tilt.
Innovation Solution
A brush tilt adjustment apparatus utilizing acceleration sensors and motor torque sensors to measure the brush's position and rotation torque, coupled with position adjustment motors, to accurately estimate and adjust the brush's tilt based on preset conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the tilt of the brush is adjusted manually or estimated based on vibration frequency difference, then the device complexity is reduced, but the measurement precision and manufacturing precision of brush tilt deteriorate
Solution Approach 1:
The patent replaces manual adjustment methods with an automated control system that uses sensors (acceleration sensors and motor torque sensors) to detect brush position and tilt, then uses a processing unit to calculate and control the brush tilt angle, substituting mechanical estimation with electronic measurement and control
Solution Approach 2:
The patent introduces acceleration sensors and motor torque sensors as intermediary devices that measure brush movement and rotation torque, providing intermediate data that the processing unit uses to calculate precise tilt angles, thereby bridging the gap between simple mechanical adjustment and precise tilt control
2Device complexity
If the tilt of the brush is adjusted manually or estimated based on vibration frequency difference, then the device complexity is reduced, but the manufacturing precision of brush tilt deteriorates
Solution Approach 1:
The patent implements a feedback control system where acceleration sensors and motor torque sensors continuously monitor brush position and rotation torque, the processing unit calculates the actual tilt angle based on this feedback data, and the system adjusts the brush position to achieve the target tilt angle, ensuring consistent manufacturing precision
Solution Approach 2:
The patent replaces manual tilt adjustment with an automated feedback-controlled system that uses electronic sensors and processing units to precisely control and reproduce the target tilt angle, ensuring consistent manufacturing precision across multiple operations
3Measurement precision
If sensors and position adjusters are added to accurately measure and adjust brush tilt, then the measurement precision and manufacturing precision of brush tilt are improved, but the device complexity increases
Solution Approach 1:
The patent makes the acceleration sensors and motor torque sensors serve multiple functions: detecting brush position, measuring rotation torque, providing feedback for tilt calculation, and enabling automated control, thereby reducing the need for separate dedicated components and mitigating the increase in device complexity
4Manufacturing precision
If sensors and position adjusters are added to accurately measure and adjust brush tilt, then the manufacturing precision of brush tilt is improved, but the device complexity increases
Solution Approach 1:
The patent uses feedback from acceleration sensors and motor torque sensors to continuously monitor and adjust brush tilt, ensuring high manufacturing precision through automated control that compensates for wear and variation, making the increased device complexity worthwhile for achieving consistent precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise adjustment of the brush tilt to ensure effective cleaning of wafers, even when the brush is worn, by accurately estimating and adjusting the tilt to a target position.
Implementation Method 1
a sensor unit including acceleration sensors and a motor torque sensor mounted around the brush
Implementation Method 2
a sensor unit including acceleration sensors and a motor torque sensor mounted around the brush
Data Source
AI summary
Provided is a brush tilt adjustment apparatus. The brush tilt adjustment apparatus includes a wafer cleaner configured to clean a wafer using a brush, a sensor unit including acceleration sensors and a motor torque sensor mounted around the brush, a brush position adjuster including position adjustment motors configured to adjust a position of the brush in a vertical direction on both sides of the brush, and a processing unit configured to detect a position value of each side of the brush and configured to estimate a tilt of the brush, in which the brush position adjuster is configured to adjust the position of the brush based on at least one of the estimated tilt of the brush and the position value.