Wafer Transfer Buffer Venting for Particle Leakage Control

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Solution Overview

Problem

In semiconductor process equipment, particles generated due to mechanical friction during wafer transfer can leak into the VFEM system, compromising apparatus and system reliability.

Innovation Solution

A wafer transfer apparatus with a buffer unit containing centrifugal fans is used to discharge fluid and particles generated by mechanical friction, preventing their leakage into the VFEM system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the robot moves up and down to transfer wafers, then wafer transfer function is achieved, but particles are generated and leak into the VFEM system

Engineering Contradiction:
Improvewafer transfer capabilityVSAvoidparticle generation
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The system is divided into separate pressure zones: a first pressure zone containing the robot and belt units, and a second pressure zone containing the VFEM system. The pressure difference between these zones prevents particle leakage while maintaining wafer transfer functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A buffer unit acts as an intermediary component between the first and second pressure zones. This buffer unit, equipped with centrifugal fans, controls fluid flow and maintains pressure differential to prevent particle generation and leakage during robot operation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If mechanical friction occurs during robot movement, then wafer transfer is enabled, but particles are generated that compromise system reliability

Engineering Contradiction:
Improverobot movementVSAvoidsystem reliability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The buffer unit with centrifugal fans is positioned beforehand to capture and remove particles generated by mechanical friction before they can leak into the VFEM system. The pressure control mechanism is pre-established to prevent particle generation at the source.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Area of stationary object

If a stack structure is used to minimize robot transfer space, then installation area is reduced, but particle leakage risk increases

Engineering Contradiction:
Improveinstallation areaVSAvoidparticle leakage
Core Design Contradiction:
Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

Different regions of the system are assigned different pressure qualities: the robot transfer region operates at a higher pressure than the VFEM region. This local pressure differentiation allows compact stack structure while preventing particle leakage into the sensitive VFEM area.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively prevents particle leakage by increasing internal pressure and using centrifugal fans to discharge particles, enhancing apparatus and system reliability.

Implementation Method 1

the buffer unit includes a plurality of centrifugal fans configured to discharge fluid from an inner space of the buffer unit to an outside of the buffer unit

Methodology Applied
Scientific EffectCentrifugal force: Centrifugal Force

Implementation Method 2

particles generated due to the robot's mechanical friction

Methodology Applied
Scientific EffectFriction: Friction

Data Source

PatentUS12552619B2Wafer transfer apparatus, wafer transfer system, and method for removing particles in wafer transfer apparatus
Publication Date: 2026.02.17 SAMSUNG ELECTRONICS CO LTD
  • US12552619B2 patent drawing
  • US12552619B2 patent drawing
  • US12552619B2 patent drawing

AI summary

A wafer transfer apparatus includes a plate, a first belt unit on a first surface of the plate and including a first linear motion (LM) guide movable up and down, a second belt unit on the first surface of the plate and including a second LM guide movable up and down, a robot between the first belt unit and the second belt unit connected to the first LM guide and the second LM guide, and configured to transfer a wafer in a vertical direction, and a buffer unit between the first belt unit and the second belt unit in a first direction and disposed between the plate and the robot in a second direction perpendicular to the first direction, wherein the buffer unit includes a plurality of centrifugal fans configured to discharge fluid from an inner space of the buffer unit to an outside of the buffer unit.