Dual-Plate Wafer Burn-In Contact Assembly for Mixed-Voltage Tests
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Solution Overview
Problem
Existing burn-in test apparatuses face challenges in efficiently performing both high-voltage and low-voltage tests on integrated circuits at a wafer level, leading to oversizing of components and increased energy and cost expenditures.
Innovation Solution
A burn-in apparatus with separate contact plates for high-voltage and low-voltage tests within a single chamber, utilizing actuators to vertically move an intermediate housing for precise contact with either set of contacts, and a shell with integrated heating and cooling for thermal control without external heating sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuitry and contacts are sized to withstand the maximum applied voltage for high-voltage tests, then high-voltage testing capability is achieved, but component oversizing occurs for low-voltage applications
Solution Approach 1:
The contact device is divided into separate first and second contact plates, each dedicated to specific voltage ranges. The first contact plate handles high-voltage tests while the second contact plate handles low-voltage tests, eliminating the need for oversized components in low-voltage applications.
Solution Approach 2:
The intermediate housing can be displaced vertically to selectively connect different contact plates to the BID. This dynamic reconfiguration allows the system to adapt between high-voltage and low-voltage testing modes, using only the appropriately sized components for each test type.
2Ease of manufacture
If separate circuitries and contacts are used for high-voltage and low-voltage tests, then component costs are reduced, but device complexity increases
Solution Approach 1:
Both high-voltage and low-voltage contact plates are integrated into a single contact device assembly with a common intermediate housing. This unified structure allows separate circuitries to share mechanical support, alignment features, and control mechanisms, reducing overall device complexity despite having multiple contact plates.
Solution Approach 2:
The intermediate housing serves multiple functions: it supports both contact plates, provides vertical displacement capability, and interfaces with the BID. This multi-functional design consolidates what could be separate complex assemblies into a single integrated component.
3Productivity
If a single chamber is used for both high-voltage and low-voltage tests, then productivity is improved, but electrical isolation requirements increase
Solution Approach 1:
The high-voltage circuitry is electrically isolated by extracting it onto a separate first contact plate that can be selectively connected. When low-voltage tests are performed, the high-voltage contact plate remains disconnected, automatically providing electrical isolation without requiring complex shielding or isolation circuits in the shared chamber.
Data Source
Figure 1~2
Figure 3~5
Figure 6~8
AI summary
Burn-in apparatus comprising at least one rack and a plurality of chambers to receive a respective plurality of wafers to be tested, each one housed on a dedicated BID (5), wherein each chamber comprises a contact device (400) which is capable of contacting said BID (5), said contact device (400) comprising a first contact plate (404), provided with electrical contacts for high-voltage tests (404'), which are capable of contacting first electrical contacts (51) of said BID (5) and a second contact plate (405), provided with electrical contacts for low-voltage tests (405'), which are capable of contacting second electrical contacts (52) of said BID (5)