Wafer Level Camera Module Snap-in Latch Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Wafer level camera modules face challenges in high production costs and low yields, along with issues of mechanical strength, electromagnetic compatibility, and stray light artifacts, which need to be addressed to improve their performance and manufacturing efficiency.
Innovation Solution
The implementation of a wafer level camera module assembly method that includes a protective tube with a snap-in latch mechanism, which secures the lens stack and image sensor module within a metal housing, enhancing mechanical strength, EMC performance, and reducing stray light artifacts, while allowing for increased yields and reduced production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional assembly methods are used for wafer level camera modules, then production costs are high and yields are low, but implementing a snap-in latch mechanism increases manufacturing complexity
Solution Approach 1:
The housing is divided into a first housing portion and a second housing portion that can be separately assembled. The snap-in latch mechanism is segmented into discrete components that can be manufactured independently and then assembled together, enabling modular production that improves yield while managing complexity through standardized interfaces.
Solution Approach 2:
The snap-in latch mechanism is designed to automatically engage and secure the lens stack and image sensor module when the housing portions are assembled. The mechanical interlocking feature provides self-alignment and self-securing functionality, reducing the need for complex external fastening systems and minimizing assembly steps.
2Strength
If components are loosely assembled in metal housing, then manufacturing is simple, but mechanical strength and EMC performance are insufficient
Solution Approach 1:
The snap-in latch mechanism is pre-designed into the housing structure during manufacturing. The interlocking features are pre-formed on the housing portions before assembly, ensuring that when the components are assembled, the mechanical strength and EMC performance are immediately achieved without requiring additional fastening operations or complex assembly procedures.
3Object-affected harmful factors
If traditional housing structures are used, then assembly is simple, but stray light artifacts and EMC performance are poor
Solution Approach 1:
The snap-in latch mechanism extracts the stray light blocking function from the general housing structure and concentrates it in specific strategic locations where light interference is most critical. By placing latch features at key interfaces and openings, the design selectively blocks stray light paths without requiring the entire housing to be complex or heavily shielded.
Data Source
AI summary
An apparatus includes an image sensor module with a lens stack disposed on the image sensor module. A protective tube is disposed on the image sensor module and encloses the lens stack. The protective tube includes an outer wall having a snap-in latch element disposed thereon. A metal housing encloses the protective tube. The metal housing includes a housing foot and inner wall having an opposite snap-in latch element disposed thereon. The image sensor module is adapted to be secured between the housing foot of the metal housing and the protective tube when the opposite snap-in latch element of the metal housing is engaged with the snap-in latch element of the protective tube.