Wafer-Based Camera Module Molded Lens Alignment

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Solution Overview

Problem

Current digital camera modules for small, inexpensive cameras are labor-intensive, delicate, and require complex alignment processes, making them costly and unreliable.

Innovation Solution

A camera module design featuring a lens assembly rigidly affixed to a camera chip using a molded component on a printed circuit board, with the lens held in place by an adhesive, allowing for accurate positioning and minimal components, enabling a compact, rugged, and reliable unit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional integrated chip and lens assemblies are enclosed in mechanical housing with separate attachment, then the camera module can be assembled with discrete components, but the manufacturing process becomes labor-intensive and requires complex alignment apparatus

Engineering Contradiction:
Improvemanufacturing processVSAvoidattachment mechanism
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent merges the lens holder and camera chip housing into a single integrated component. The lens holder is formed as an integral part of the camera chip housing, eliminating the need for separate attachment mechanisms and alignment apparatus. This integration directly resolves the contradiction by simplifying the device structure while maintaining ease of manufacture through reduced assembly steps.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The camera chip housing serves multiple functions: it protects the camera chip, provides structural support, and integrates the lens holder functionality. This multi-functionality eliminates the need for separate mechanical housing and attachment components, thereby reducing device complexity while maintaining ease of manufacture.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If lens assembly is mechanically attached to chip housing with alignment apparatus, then the components can be assembled separately, but the process becomes delicate and prone to misalignment when dropped

Engineering Contradiction:
Improveattachment durabilityVSAvoidalignment mechanism
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By integrating the lens holder as an integral part of the camera chip housing, the patent eliminates separate alignment mechanisms and attachment apparatus. The lens assembly is directly mounted within the integrated housing structure, making the attachment robust and resistant to misalignment from drops or shocks, thereby improving reliability without adding complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated housing structure provides self-alignment through its molded geometry. The lens holder is precisely formed within the housing during manufacturing, eliminating the need for external alignment apparatus or delicate adjustment mechanisms. This self-service approach ensures reliable attachment that withstands physical shocks.

Inventive Principle:
Principle #25Self-service

3Productivity

If multiple attachment parts and alignment apparatus are used, then the components can be assembled with flexibility, but the manufacturing becomes time-consuming and labor-intensive

Engineering Contradiction:
Improveassembly speedVSAvoidnumber of components
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent combines multiple components (housing, lens holder, and mounting structure) into a single integrated camera chip housing. This merger eliminates the need for multiple attachment parts and alignment apparatus, significantly reducing the number of assembly steps and improving productivity without adding device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated housing is designed as a single molded component that can be manufactured efficiently using injection molding or similar processes. This segmentation at the manufacturing level allows for high-volume production of the integrated assembly, improving productivity while keeping the final device complexity low.

Inventive Principle:
Principle #1Segmentation

4Volume of moving object

If conventional mechanical housing is used to enclose components, then the camera module can be assembled with standard components, but the final unit size becomes larger than necessary

Engineering Contradiction:
Improvecamera module sizeVSAvoidhousing structure
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

By integrating the lens holder and housing into a single component, the patent eliminates the need for additional mechanical housing layers and attachment structures. This merger reduces the overall volume of the camera module while maintaining structural integrity and protecting internal components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The lens assembly is nested within the integrated housing structure, with the lens holder formed as an internal cavity or recess within the housing. This nesting arrangement maximizes space utilization and minimizes the external dimensions of the camera module without requiring complex housing structures.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces manufacturing complexity and cost, enhances durability, and ensures accurate lens alignment for optimal picture quality without the need for active alignment, facilitating the production of small, inexpensive, and reliable camera modules.

Implementation Method 1

The lens assembly is then inserted into the molded component and held in place therein by an adhesive

Methodology Applied
Scientific EffectAdhesive: Adhesive

Data Source

PatentUS7796187B2Wafer based camera module and method of manufacture
Publication Date: 2010.09.14 NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
  • US7796187B2 patent drawing
  • US7796187B2 patent drawing
  • US7796187B2 patent drawing

AI summary

An integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12). In a particular embodiment, lens holders (306, 506) are formed entirely on the camera chips (302, 502) before or after they are separated from one another.