Wafer Carrier Ambient Control via Adsorption
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor substrates are exposed to undesirable ambients like moisture and oxygen during transfer and storage in integrated circuit fabrication, leading to the need for additional cleaning processes to remedy damage.
Innovation Solution
A semiconductor manufacturing system with an interface system and carrier that provide a protective, ambient-controlled environment using enclosures, robotic systems, gas valves, ambient control tanks, and adsorptive devices to maintain low levels of moisture and oxygen, ensuring substrates are not exposed to harmful ambients during processing and transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are transferred and stored in ambient environment during manufacturing, then ease of operation is improved, but substrate quality deteriorates due to exposure to moisture and oxygen
Solution Approach 1:
The patent applies inert atmosphere principle by providing a controlled ambient environment within the carrier that maintains low levels of moisture and oxygen through adsorptive devices and catalysts, protecting substrates from harmful ambients during transfer and storage operations
Solution Approach 2:
The patent uses adsorptive devices and catalysts as intermediaries between the substrate and the ambient environment, which actively remove moisture and oxygen from the carrier interior to prevent direct contact between harmful ambients and the substrate surface
2Manufacturing precision
If additional cleaning processes are implemented to remedy substrate damage from ambient exposure, then substrate quality is improved, but device complexity and processing time increase
Solution Approach 1:
The patent applies preliminary action principle by maintaining a controlled ambient environment during substrate transfer and storage, preventing contamination before it occurs, thereby eliminating the need for subsequent cleaning processes to remedy damage
3Ease of operation
If substrates are exposed to undesired ambients during transfer, then ease of operation is improved, but additional cleaning processes are required to remove contamination
Solution Approach 1:
The patent creates a controlled inert atmosphere within the carrier enclosure that maintains low levels of moisture, oxygen, and airborne molecular contamination through adsorptive devices, allowing easy substrate handling without contamination
Solution Approach 2:
The adsorptive devices and catalysts serve as intermediaries that actively remove harmful contaminants from the carrier environment, preventing direct contact between substrates and airborne molecular contamination during transfer operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces moisture and oxygen levels to parts per million, minimizing the need for extra cleaning steps and protecting substrates from environmental contamination, thereby enhancing the manufacturing process efficiency.
Implementation Method 1
a pre-defined structure including an adsorptive device, wherein the adsorptive device reduces a content of moisture, oxygen, or other residues in the semiconductor wafer container
Implementation Method 2
a shape similar to a wafer and one or more catalysts, wherein the one or more catalysts reduce moisture ambient and/or oxygen ambient content within the wafer container
Data Source
AI summary
A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.