Wafer Carrier Ambient Control for Moisture and Oxygen Exposure
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Solution Overview
Problem
Semiconductor substrates are exposed to undesirable ambients like moisture and oxygen during transfer and storage in semiconductor manufacturing, leading to the need for additional cleaning processes to remedy damage.
Innovation Solution
A semiconductor manufacturing system with an interface system and carrier that provide a protective, ambient-controlled environment using enclosures, robotic systems, gas control, and adsorptive devices with catalysts to maintain low levels of moisture and oxygen, ensuring substrates are not exposed to harmful ambients during processing and transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are transferred and stored in open environment during fabrication processes, then ease of operation and accessibility are improved, but substrate exposure to harmful ambients (moisture, oxygen, airborne molecular contamination) increases
Solution Approach 1:
The patent implements enclosed carrier systems that maintain inert or controlled atmosphere environments during substrate transfer and storage. The carriers create sealed environments that prevent substrate exposure to harmful ambients like moisture and oxygen, while still allowing robotic systems to access and transfer substrates through controlled interfaces.
Solution Approach 2:
The patent introduces intermediate carrier systems that act as mediators between process chambers and storage areas. These carriers provide a protective interface that shields substrates from harmful environmental factors during transfer operations, enabling easy accessibility without direct exposure to contaminants.
2Manufacturing precision
If additional cleaning processes are implemented to remedy substrate damage from ambient exposure, then substrate purity is improved, but manufacturing complexity and processing time increase
Solution Approach 1:
The patent applies preliminary protective actions by maintaining substrates in controlled atmosphere carriers from the moment they leave process chambers until they reach their destination. This preliminary protection prevents contamination before it occurs, eliminating the need for subsequent cleaning processes and reducing manufacturing complexity.
3Ease of operation
If substrates are exposed to undesired ambients during transfer, then ease of transfer operation is improved, but additional cleaning steps are required which reduce productivity
Solution Approach 1:
The patent uses inert atmosphere carriers that maintain protective environments during substrate transfer operations. These carriers enable easy substrate handling and transfer while preventing exposure to harmful ambients, thereby eliminating the need for additional cleaning steps and maintaining high manufacturing throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces moisture and oxygen levels to parts per million, minimizing the need for extra cleaning steps and maintaining substrate quality by creating a controlled environment for substrate handling and processing.
Implementation Method 1
a pre-defined structure including an adsorptive device, wherein the adsorptive device reduces a content of moisture, oxygen, or other residues in the semiconductor wafer container
Implementation Method 2
one or more catalysts, wherein the one or more catalysts reduce moisture ambient and/or oxygen ambient content within the wafer container
Data Source
AI summary
A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.