Semiconductor Wafer Carrier Bonding and Detachment via Segmented Adhesion

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Solution Overview

Problem

Conventional methods for handling semiconductor wafers during manufacturing, particularly when detaching wafer chucks, can damage the wafers due to the high pulling force required, and as wafers become thinner, improved handling techniques are necessary to prevent damage and ensure safe transport.

Innovation Solution

A method involving attaching a carrier to the semiconductor wafer with a weaker adhesive on the active surface and a stronger adhesive on the inactive surface, allowing for separation into inner and outer portions using a blade or laser, and subsequent detachment using a dicing tape with varying adhesives and coatings to minimize damage and facilitate easy handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a carrier is attached to the semiconductor wafer using strong adhesive, then the wafer is securely held during handling, but high pulling force is required to detach the carrier which can damage the wafer

Engineering Contradiction:

Improveadhesive bond strengthVSAvoidwafer damage during detachment

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The wafer is divided into an inner portion and an outer portion through partial cutting. The carrier is detached from the inner portion using low pulling force while the outer portion remains attached, preventing wafer damage. The cutting creates a separation line that allows selective detachment of different wafer regions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the wafer are treated differently: the inner portion is cut and designed for easy detachment with low pulling force, while the outer portion remains intact and strongly bonded. This local differentiation allows the carrier to be removed from critical areas without damaging the wafer structure.

Inventive Principle:

Principle #3Local quality

2Ease of operation

If the wafer is cut into inner and outer portions, then the carrier can be easily removed from the inner portion, but additional processing steps are required

Engineering Contradiction:

Improvecarrier detachment easeVSAvoidnumber of processing steps

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The wafer is pre-cut into inner and outer portions before carrier detachment. This preliminary cutting action creates the conditions for easy subsequent carrier removal from the inner portion, as the cut edges provide a natural separation line that reduces the pulling force needed for detachment.

Inventive Principle:

Principle #10Preliminary action

3Ease of operation

If the adhesive strength between the wafer and carrier is reduced for easy detachment, then the carrier can be removed with low pulling force, but the wafer may not be securely held during handling

Engineering Contradiction:

Improvecarrier detachment easeVSAvoidwafer holding security

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The wafer is segmented into inner and outer portions with different bonding characteristics. The inner portion is designed for easy detachment with low pulling force, while the outer portion maintains strong bonding to ensure secure handling. This segmentation allows simultaneous achievement of secure holding and easy detachment in different regions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the wafer have different adhesive bond strengths: the inner portion has weak bonding for easy carrier removal, while the outer portion has strong bonding for secure handling. This local quality differentiation resolves the contradiction between holding security and detachment ease.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces the risk of wafer damage during handling and transport, increases yield rates, and accelerates the detachment process, providing enhanced protection and support for the wafers during processing.

Implementation Method 1

adhesively attaching the carrier to an active surface of the semiconductor wafer, wherein an adhesive bonds the active surface of the semiconductor wafer to an isolation coating disposed on a surface of the carrier

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

separating the semiconductor wafer into an inner portion and an outer portion by cutting the semiconductor wafer into the inner portion and the outer portion using a blade or a laser

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS8975157B2Carrier bonding and detaching processes for a semiconductor wafer

Publication Date: 2015.03.10 ADVANCED SEMICON ENG INC

AI summary

The present invention provides a temporary carrier bonding and detaching process. A first surface of a semiconductor wafer is mounted on a first carrier by a first adhesive, and a first isolation coating is disposed between the first adhesive and the first carrier. Then, a second carrier is mounted on the second surface of the semiconductor wafer. The first carrier is detached. The method of the present invention utilizes the second carrier to support and protect the semiconductor wafer, after which the first carrier is detached. Therefore, the semiconductor wafer will not be damaged or broken, thereby improving the yield rate of the semiconductor process. Furthermore, the simplicity of the detaching method for the first carrier allows for improvement in efficiency of the semiconductor process.