Wafer Carrier Cleaning Chambers for Contamination-Free Transfer
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Solution Overview
Problem
Semiconductor fabrication processes are susceptible to defects due to contaminants introduced during wafer transportation, as wafer carriers can contaminate sterile environments within process chambers.
Innovation Solution
A cleaning apparatus comprising a wet chamber for washing and a dry chamber for drying wafer carriers, utilizing a robotic transport system and infrared lamps to minimize contamination, with deionized water and controlled atmospheres to effectively clean and dry wafer carriers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafer carriers are used to transport semiconductor wafers between process chambers, then wafer transportation efficiency is improved, but contaminants are introduced to sterile environments
Solution Approach 1:
The patent extracts the wafer carrier cleaning function from the main fabrication process by introducing a separate cleaning apparatus with wet and dry chambers. This allows wafer carriers to be cleaned independently before entering sterile process chambers, removing contaminants without disrupting the main fabrication workflow.
Solution Approach 2:
The cleaning apparatus acts as an intermediary between the non-sterile transportation environment and the sterile process chambers. By positioning the cleaning apparatus as a intermediate step, wafer carriers are purified before entering the sterile zone, preventing contaminant transfer while maintaining transportation efficiency.
2Manufacturing precision
If cleaning apparatus with wet and dry chambers is used, then contaminant removal effectiveness is improved, but device complexity increases
Solution Approach 1:
The cleaning apparatus is segmented into distinct wet chamber and dry chamber components, each performing a specific cleaning function. This segmentation allows for optimized contaminant removal at each stage while enabling independent maintenance and operation of each chamber, managing overall system complexity.
Solution Approach 2:
The patent merges the washing and drying functions into a single integrated cleaning apparatus that processes wafer carriers sequentially through wet and dry chambers. This combination eliminates the need for separate cleaning devices, reducing overall facility complexity while maintaining effective contaminant removal.
3Extent of automation
If robotic transport system is implemented, then automation level is improved, but risk of contamination during transport increases
Solution Approach 1:
The robotic transport system maintains continuous operation by seamlessly moving wafer carriers from the wet chamber to the dry chamber without interrupting the cleaning process. This continuous action minimizes exposure time to potential contaminants while maintaining high automation levels.
Solution Approach 2:
The patent implements controlled atmospheres within the cleaning apparatus chambers to create protective environments during robotic transport. By maintaining inert or controlled atmospheric conditions, the system reduces contamination risk during automated handling and transfer operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated cleaning apparatus efficiently removes contaminants from wafer carriers, reducing the risk of defects in semiconductor fabrication by minimizing exposure to external contaminants and ensuring thorough cleaning and drying, thereby enhancing fabrication quality and throughput.
Implementation Method 1
The cleaning apparatus also includes a drying system introduced to the dry chamber. The drying system includes a plurality of infrared lamps arranged to extend upward within the dry chamber radially inside of the spin chuck
Implementation Method 2
controlling operation of the drying system to remove at least a portion of the cleaning liquid from the wafer carrier within the dry chamber
Implementation Method 3
The spin chuck is pivotal about an axis of rotation... controlling operation of the drying system to remove at least a portion of the cleaning liquid from the wafer carrier
Data Source
AI summary
A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives the wafer carrier to be washed and a reservoir in fluid communication with the wet chamber. The reservoir stores a cleaning liquid that is introduced to the wafer carrier within the wet chamber during a washing operation, and a dry chamber is spaced apart from the wet chamber. The dry chamber receives the wafer carrier after the wafer carrier is washed in the wet chamber and holds the wafer carrier during a drying operation. A transport system transports the wafer carrier between the wet chamber and the dry chamber during a cleaning process.