Wafer Carrier with Integrated Contact Structures for Thin Wafer Testing
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Solution Overview
Problem
The processing of thin or ultra-thin wafers is challenging due to mechanical instability, which prevents electrical testing of electronic components during manufacturing, as commonly used bulk glass carriers render some electrical contacts inaccessible.
Innovation Solution
A wafer arrangement involving a carrier with an integrated wiring structure that allows electrical connection to exposed contacts on the wafer, enabling testing without damaging the wafer and providing mechanical stability for processing, including the use of an adhesive layer for secure mounting and easy separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a bulk glass carrier is used to provide mechanical stability for thin wafers, then the wafer can be processed, but electrical contacts become inaccessible for testing
Solution Approach 1:
The carrier is segmented into multiple regions: a bulk glass carrier for mechanical stability, and a separate carrier plate with contact structures for electrical testing. This segmentation allows each part to fulfill its specific function without interfering with the other.
Solution Approach 2:
A carrier plate acts as an intermediary between the bulk glass carrier and the wafer. The carrier plate provides contact structures that can electrically contact the wafer's exposed contacts while the bulk glass carrier provides mechanical stability, thus mediating between the two conflicting requirements.
2Ease of operation
If the wafer is pressed against the carrier to enable electrical contact, then testing can be performed, but the adhesive layer may interfere with contact
Solution Approach 1:
The adhesive layer structure has different local properties: it provides strong adhesion in most areas to secure the wafer, but has reduced adhesion or gaps in specific locations where contact structures need to access the electronic contacts. This local differentiation allows both adhesion and electrical contact.
Solution Approach 2:
The system transitions from a static adhesive layer to a dynamic configuration where the adhesive layer can be selectively removed or deformed in contact regions. This allows the adhesive layer to adapt its properties based on the operational requirement - providing adhesion when needed and allowing contact when needed.
3Reliability
If electronic components are tested after dicing, then individual components can be tested, but the process time and complexity increase
Solution Approach 1:
The contact structures are pre-positioned on the carrier plate to align with the electronic contacts on the wafer before testing. This preliminary arrangement of contact structures allows for immediate electrical contact and testing without requiring complex alignment procedures during the testing process.
Solution Approach 2:
Multiple contact structures for testing different electronic components are merged into a single integrated carrier plate. This allows simultaneous testing of multiple components in parallel, reducing the overall testing time compared to testing each component individually after dicing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient electrical testing and processing of thin wafers without damaging them, allowing for the identification of defective components early in the manufacturing stage and facilitating parallel testing of multiple components.
Implementation Method 1
an adhesive layer structure disposed over the surface of the wafer, the adhesive layer structure covering the at least one electronic contact; and a carrier adhered to the wafer via the adhesive layer structure
Data Source
AI summary
According to various embodiments, a wafer arrangement may be provided, the wafer arrangement may include: a wafer including at least one electronic component having at least one electronic contact exposed on a surface of the wafer; an adhesive layer structure disposed over the surface of the wafer, the adhesive layer structure covering the at least one electronic contact; and a carrier adhered to the wafer via the adhesive layer structure, wherein the carrier may include a contact structure at a surface of the carrier aligned with the at least one electronic contact so that by pressing the wafer in direction of the carrier, the contact structure can be brought into electrical contact with the at least one electronic contact of the at least one electronic component.