Wafer Carrier Disc Pre-Jig Handling for Precise Assembly Alignment
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Solution Overview
Problem
Existing wafer handling mechanisms in integrated circuit manufacturing are prone to precision issues, leading to potential damage and reduced efficiency due to the fragility of wafers and the need for precise alignment and assembly operations.
Innovation Solution
A pre-jig wafer carrier disc installation/uninstallation device utilizing a robotic arm with displacement mechanisms, image capturing assemblies, and rangefinder components to ensure precise alignment and assembly of wafers, masks, and frames, enhancing operational efficiency and reducing the risk of damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple removing mechanisms are used to perform assembling/disassembling operations of wafers and components, then the processing efficiency is improved, but the operational precision and relative positioning accuracy between mechanisms deteriorate
Solution Approach 1:
The patent combines multiple removing mechanisms (wafer frame removing assembly, wafer removing assembly, mask removing assembly) into a single integrated device with a common support structure and control system. This merging approach allows the mechanisms to work cooperatively while maintaining precise relative positioning through shared mechanical references and coordinated control, thereby preserving assembling precision while achieving high processing efficiency through automated batch operations.
2Productivity
If automatic machines are used to perform taking/placing operations of wafers on carrier disc, then labor is saved and processing efficiency is enhanced, but the operational precision requirement increases due to wafer fragility
Solution Approach 1:
The patent replaces manual mechanical operations with automated removing mechanisms that use controlled mechanical forces, suction, and positioning systems. The wafer removing assembly employs suction cups for gentle grasping, while the mask removing assembly uses precision positioning and controlled detachment. These automated systems eliminate human error and provide consistent, repeatable operations with high precision, thereby enhancing both productivity and reliability simultaneously.
3Productivity
If multiple wafers are secured on a large-area carrier disc for mass processing, then the processing efficiency of wafers as a whole is enhanced, but the complexity of handling and positioning the assembly increases
Solution Approach 1:
The patent segments the wafer processing system into modular removing assemblies (wafer frame removing assembly, wafer removing assembly, mask removing assembly) that can independently handle different components. Each assembly is designed to work with specific parts of the carrier disc assembly, allowing for simplified, specialized operations rather than a single complex mechanism. This segmentation reduces handling complexity while maintaining high processing efficiency through parallel operations on multiple wafers simultaneously.
Data Source
AI summary
A pre-jig wafer carrier disc installation/uninstallation device and a method thereof, including a first displacement mechanism, a wafer frame installation/uninstallation mechanism, a wafer installation/uninstallation mechanism, a mask installation/uninstallation mechanism and a robotic arm arranged around the first displacement mechanism. The said mechanisms sequentially stack the wafer frame, the wafer and the mask on the first displacement mechanism to form an assembly. An installation/uninstallation mechanism is disposed at a movable end of the robotic arm. The robotic arm drives the installation/uninstallation mechanism to remove and lock the assembly on an assembly carrier section of a carrier disc for successive processing. After the wafers are processed, the robotic arm drives the installation/uninstallation mechanism to move the assembly back onto the first displacement mechanism. The said mechanisms sequentially disassemble the assembly and recover the mask, the wafer and the wafer frame.