Wafer Carrier Docking Tray Geometry for Accurate Gas Filling
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Solution Overview
Problem
Wafer carriers face issues with improper alignment during gas filling, leading to malfunctioning inflation, reduced airtightness, and positioning reliability due to positional errors when mounted on gas filling docking trays.
Innovation Solution
The gas filling docking tray incorporates guide blocks with vertical and inclined portions, positioning pins, and adjustable nozzles to guide and position wafer carriers accurately, ensuring smooth placement and maintaining airtightness by setting specific height relationships among these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wafer carrier is not properly aligned with the gas filling docking tray, then the gas filling device cannot reach the optimal inflation position, but adding alignment mechanisms increases device complexity
Solution Approach 1:
The guide blocks and positioning pins are pre-installed on the gas filling docking tray to establish alignment references before the wafer carrier is placed. This preliminary alignment structure ensures that when the wafer carrier is loaded, it automatically conforms to the correct position without requiring complex real-time adjustment mechanisms during the gas filling operation.
Solution Approach 2:
The guide blocks serve as intermediary elements between the gas filling docking tray and the wafer carrier. These guide blocks with inclined portions mediate the alignment process by providing a physical interface that guides the wafer carrier into the correct position, simplifying the overall alignment system while maintaining high positioning reliability.
2Manufacturing precision
If guide blocks with inclined portions are added to guide the wafer carrier, then positioning accuracy is improved, but the device structure becomes more complex
Solution Approach 1:
The guide blocks incorporate inclined portions with curved or angled surfaces that guide the wafer carrier along a controlled path during placement. This curved surface design enables smooth guidance and automatic alignment through geometric constraints rather than complex mechanical adjustment mechanisms, achieving high positioning accuracy with relatively simple structural additions.
3Reliability
If multiple nozzles at different heights are added to accommodate positioning variations, then gas filling reliability is improved, but the device complexity increases
Solution Approach 1:
The gas filling system is segmented into multiple nozzles positioned at different heights, each capable of independently delivering gas to specific regions of the wafer carrier. This segmentation allows the system to maintain effective gas filling across various positioning scenarios without requiring a single complex adjustable nozzle mechanism, thereby improving reliability while managing device complexity through modular architecture.
Data Source
AI summary
A gas filling docking tray having a carrier substrate includes a base surface, a plurality of guide blocks, a plurality of positioning pins, and at least one pair of nozzles. The guide blocks are at least disposed on two opposite sides of the base surface to define a wafer carrier accommodation area, and each guide block includes a vertical portion substantially perpendicular to the base surface and an inclined portion located above and connected with the vertical portion. A height of an apex of each positioning pin relative to the base surface is greater than a height of an apex of the vertical portion and less than a height of an apex of the inclined portion relative to the base surface.