Wafer Carrier Drying via Oscillating Spray and Heating
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Solution Overview
Problem
Current methods for drying manufacturing fixtures, such as wafer carriers, are inefficient and time-consuming, particularly in achieving a clean and dry state within a super clean environment, as they often require extensive cycles and may not effectively remove residual fluids.
Innovation Solution
An apparatus and method involving a chamber with perpendicular exterior and interior spray systems that oscillate in a sweeping motion, combined with a heating system and a mini clean environment, to efficiently wash and dry wafer carriers by using water and compressed gas, ensuring thorough drying and reduced processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If conventional drying methods are used for manufacturing fixtures, then the fixtures can be dried, but the drying time is extensive and inefficient
Solution Approach 1:
The drying system is segmented into multiple spray bars with numerous nozzles distributed across different locations. The exterior spray bar has nozzles positioned at various heights and angles, while the interior spray bar provides internal drying. This segmentation allows simultaneous drying of multiple surfaces, dramatically reducing total drying time compared to conventional single-source drying methods.
Solution Approach 2:
The patent introduces vertical dimensionality with spray nozzles positioned at multiple heights (e.g., 2 inches, 4 inches, 6 inches from the carrier surface). The exterior spray bar extends vertically and horizontally, creating a three-dimensional spray pattern that attacks residual fluid from multiple spatial dimensions simultaneously, rather than using traditional horizontal-only drying approaches.
2Reliability
If extensive drying cycles are used to achieve complete dryness, then the fixtures reach a dry state, but the processing time increases and efficiency decreases
Solution Approach 1:
The drying system operates continuously with spray nozzles firing in sequence and overlapping patterns throughout the drying cycle. The oscillating motion of spray bars ensures continuous coverage of all carrier surfaces without interruption or idle periods, maintaining effective drying action throughout the entire 10-14 minute cycle rather than using intermittent or staged approaches.
Solution Approach 2:
The spray bars oscillate back and forth across the carrier, dynamically adjusting the spray pattern to continuously cover different areas. This dynamic motion ensures that all surfaces receive adequate drying attention throughout the cycle, achieving complete dryness faster than static drying systems that would require longer exposure times.
3Productivity
If residual fluids are not effectively removed, then the drying process is faster, but the cleanliness and dryness of the fixture is compromised
Solution Approach 1:
The drying system applies different spray characteristics to different locations on the carrier. Exterior nozzles target the outer surfaces with specific spray angles and pressures, while interior nozzles address the internal cavity. This localized quality control ensures that each area receives optimally tailored drying action, achieving complete dryness across all surfaces without compromising overall speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces drying time, achieving optimal cleanliness and dryness of wafer carriers within 10-14 minutes, allowing for higher throughput and maintaining a clean environment, with the ability to handle multiple carriers efficiently.
Implementation Method 1
spraying a liquid on an exterior of the carrier with an exterior spray system, spraying a liquid on an interior of the carrier with an interior spray system, spraying a gas on an exterior of the carrier with the exterior spray system, and spraying a gas on an interior of a carrier with the interior spray system
Implementation Method 2
At least one heating system can also be provided and the heating system can include at least one heating pad
Data Source
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AI summary
Wafer carrier washing and drying apparatus and method, especially useful for the semiconducting industry.