Wafer Carrier With Plasma Separation Layer
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Solution Overview
Problem
Conventional methods for thinning and processing wafers face challenges due to mechanical and thermal stresses, particularly when dealing with three-dimensionally structured surfaces, leading to issues with adhesion and separation of carrier layers, which can result in wafer breakage and inefficiencies in thinning and dicing processes.
Innovation Solution
A wafer carrier arrangement featuring a carrier layer system comprising a cured, partially cured, or curable elastomeric material and a plasma polymeric separating layer, where the adhesive strength between the carrier layer and the separating layer is greater than that between the wafer and the release liner, allowing for controlled separation and reduced mechanical stress during thinning and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the wafer is severely thinned to reduce original thickness, then the desired thin electronic components are achieved, but the risk of wafer breaking increases due to mechanical and thermal loads
Solution Approach 1:
A plasma polymeric separating layer is introduced as an intermediary between the wafer and the carrier layer. This separating layer has controlled adhesion properties that allow it to detach easily from the wafer after processing, thereby reducing mechanical stress and breakage risk during handling and separation operations
Solution Approach 2:
The adhesion strength of the plasma polymeric separating layer is optimized by adjusting plasma polymerization parameters (power, pressure, gas composition, treatment time) to achieve the right balance between sufficient attachment during processing and easy detachment afterward, minimizing wafer stress throughout the process
2Ease of operation
If a plasma polymeric separating layer is used to reduce adhesion issues, then separation becomes easier, but the adhesion to the carrier layer must be sufficiently strong to prevent detachment during processing
Solution Approach 1:
The plasma polymeric separating layer exhibits different adhesion characteristics at different interfaces: weak adhesion to the wafer surface for easy separation, and strong adhesion to the carrier layer for stable attachment during processing. This spatial variation in adhesion quality resolves the contradiction between easy separation and processing stability
3Strength
If conventional carrier layers are used, then structural support is provided, but they cannot adapt to three-dimensionally structured wafer surfaces, leading to adhesion failures
Solution Approach 1:
The plasma polymeric separating layer forms a flexible conformal coating that adapts to three-dimensionally structured wafer surfaces including bumps and trenches. This flexible thin film maintains intimate contact with complex surface geometries, ensuring uniform plasma treatment and stable carrier attachment across the entire wafer surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables easier handling and stabilization of wafers during processing, allowing for more extensive thinning while minimizing mechanical stress and preventing wafer breakage, especially on complex surfaces, and facilitates efficient separation and further processing of wafers.
Implementation Method 1
the plasma polymeric separating layer (4) and a layer (5) of a cured, partially cured or curable elastomeric material, wherein the adhesive strength between the carrier layer system (6, 5) and the separating layer (4)
Data Source
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AI summary
The invention relates to a wafer-carrier arrangment comprising a wafer (1), a carrier layer system (5, 6) and a separation layer (4) which is arranged between the carrier layer system (5, 6) and the wafer (1). The carrier layer system (5, 6) comprises: i) a carrier layer (6) and ii) a layer made of a hardened, partially hardenend of hardenable elastomer material on the separating layer side, or comprises both layers. The separation layer (4) is: iii) a plasma polymer layer and iv) the adhesive strength between the carrier layer system (5, 6) and the separating layer (4), according to hardening of the elastomer material, is greater than the adhesive strength between the wafer (1) and the separating layer (4).