Wafer Carrier Substrate Marks for Accurate Probe Shot Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor wafer measurement methods face challenges in accurately identifying effective measurement areas and probe contact positions, leading to decreased throughput and potential defects due to remeasurement or erroneous determinations, especially when using autoprobers and requiring additional processing like reticle addition.
Innovation Solution
A substrate for carrying wafers is designed with vacuuming holes, alignment guides, and marks for determining probe contact positions, enabling efficient alignment and measurement without additional processing, facilitating visual recognition and reducing the need for precise alignment accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If visual recognition is used to determine probe contact position, then ease of operation is improved, but measurement precision deteriorates due to inability to view entire wafer at once
Solution Approach 1:
The wafer surface is divided into multiple shots (measurement areas), and each shot is assigned a unique identification mark. The camera captures one shot at a time, and the system sequentially moves between shots based on the marks, enabling complete wafer coverage through segmented viewing rather than requiring a single wide-angle view.
Solution Approach 2:
Identification marks are introduced as intermediaries between the camera and the actual measurement positions. These marks serve as reference points that the camera can reliably detect and use to determine its location, enabling precise positioning even when the entire wafer cannot be viewed simultaneously.
2Measurement precision
If alignment marks are added to wafer to identify specific shots, then measurement precision is improved, but device complexity increases due to additional processing steps
Solution Approach 1:
The identification marks are formed on the wafer surface during the element formation process itself, before measurement takes place. This preliminary action integrates the marking step into the existing manufacturing flow, avoiding the need for separate post-processing alignment mark addition steps.
Solution Approach 2:
The same shot identification marks serve multiple functions: they identify specific measurement shots, enable camera positioning, and facilitate navigation between measurement areas. This multi-functionality eliminates the need for separate alignment marks that would otherwise be required for positioning purposes.
3Manufacturing precision
If probe card and positioning pin are used together, then positioning accuracy is improved, but reliability deteriorates due to damage to components
Solution Approach 1:
The positioning pin is extracted from the measurement system and replaced with an optical recognition approach using camera-based detection of identification marks. This eliminates the mechanical contact between positioning pins and the probe card, removing the source of component damage while maintaining positioning capability through visual recognition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient probe alignment and measurement on semiconductor wafers, improving throughput and reducing the risk of defects by allowing visual recognition of specific shots and minimizing handling errors.
Implementation Method 1
a vacuuming hole for vacuuming of the wafer placed on the wafer carrier substrate
Data Source
AI summary
The present disclosure is to provide a wafer carrier substrate for carrying a wafer on which a plurality of chips is formed, elements to be measured being built in the plurality of chips. The wafer carrier substrate includes: a vacuuming hole for vacuuming of the wafer placed on the wafer carrier substrate; a wafer alignment guide for determining a predetermined position of the wafer placed on the wafer carrier substrate; and a mark for determining a probe contact position. It is possible to recognize a specific shot, without any additional processing of the semiconductor wafer.