Semiconductor Wafer Carrier Segmentation for Dual-Side Processing
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices face challenges in balancing cost reduction and mechanical stability during processing, particularly when dealing with standard wafer sizes and thicknesses, which limits flexibility in meeting conflicting requirements for chip reliability.
Innovation Solution
A method involving processing a semiconductor body at opposite surfaces, attaching it to a carrier with an inner and outer part, and detaching the inner part of the carrier, allowing for increased flexibility in manufacturing by enabling processing and testing through both surfaces, thereby simplifying the manufacturing process and improving mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wafers are processed at the front side and back side with standard processing methods, then mechanical stability can be maintained, but process complexity increases and manufacturing flexibility is reduced
Solution Approach 1:
The carrier is divided into an inner part and an outer part that can be detached separately. The inner part is removed after front side processing to enable back side processing, while the outer part remains attached to provide mechanical stability during subsequent steps. This segmentation allows the system to adapt to different processing requirements at different stages without increasing overall process complexity.
Solution Approach 2:
The carrier configuration changes dynamically during the manufacturing process. Initially, the complete carrier (inner part + outer part) provides mechanical stability during front side processing. Then the inner part is detached to enable back side processing, creating a dynamic adaptation to different processing needs. This dynamic reconfiguration enhances manufacturing flexibility without requiring entirely different carriers for each processing stage.
2Ease of operation
If the carrier is detached completely after processing, then access to the semiconductor body is improved, but mechanical stability is reduced
Solution Approach 1:
The carrier is segmented into an inner part for attachment/detachment operations and an outer part for providing mechanical stability. The inner part is detached to enable access to the semiconductor body for back side processing and testing, while the outer part remains attached to maintain mechanical stability during these operations. This segmentation allows simultaneous achievement of access and stability requirements.
Solution Approach 2:
The inner part of the carrier acts as an intermediary element that can be selectively removed to provide access to the semiconductor body, while the outer part serves as a permanent intermediary that maintains mechanical stability. This dual-intermediary approach allows the system to switch between access mode and stability mode as needed during manufacturing and testing operations.
3Ease of manufacture
If standard wafer thicknesses are used, then manufacturing cost is reduced, but mechanical stability during processing is compromised
Solution Approach 1:
The carrier serves as an intermediary support structure that compensates for the reduced mechanical stability of standard-thickness wafers. By attaching the wafer to the carrier, the system maintains mechanical stability during processing without requiring increased wafer thickness, thereby keeping manufacturing costs low while achieving the required structural integrity.
Data Source
Figure 1A~1D
Figure 2~3D
Figure 3E~4B
AI summary
A method of manufacturing a semiconductor device in a semiconductor body (102) is proposed. The method includes processing a semiconductor body (102) at a first surface (104) of the semiconductor body (102). The method further includes attaching the semiconductor body (102) to a carrier (106) via the first surface (104). The carrier (106) includes an inner part (1061) and an outer part (1062) at least partly surrounding the inner part (1061). The method further includes processing the semiconductor body (102) at a second surface opposite to the first surface (104). The method further includes detaching the inner part (1061) of the carrier (106) from the semiconductor body (102).