Reusable Wafer Carrier Stack for UV Bonding and Flashlamp Release

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for attaching and detaching semiconductor wafers during integrated circuit manufacturing are inefficient and lack a reusable carrier system, leading to suboptimal processing and potential damage to fragile wafers.

Innovation Solution

A method involving a reusable carrier with a partially transparent light-absorbing material (LAM) layer on a transparent carrier, using UV-curable adhesive and flashlamp light pulses for secure attachment and detachment, allowing for precise alignment and multiple uses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If adhesive is placed directly between the semiconductor wafer and the carrier, then the wafer can be attached to the carrier, but the carrier cannot be reused and the process is inefficient

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidcarrier reusability

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The system is segmented into three distinct layers: the reusable transparent carrier, the light-absorbing material layer, and the semiconductor wafer. This segmentation allows the carrier to be separated from the wafer after processing, enabling carrier reuse while maintaining secure attachment during processing.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A light-absorbing material layer is introduced as an intermediary between the transparent carrier and the semiconductor wafer. This intermediary layer enables selective light absorption for controlled attachment and detachment, while allowing the carrier itself to remain reusable.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If a reusable carrier system is implemented, then carrier reusability improves, but the device structure becomes more complex

Engineering Contradiction:

Improvecarrier reusabilityVSAvoidprocess simplicity

Core Design Contradiction:

Device complexityVSEase of manufacture

Solution Approach 1:

The optical properties of the materials are strategically selected: the carrier is transparent to UV light while the intermediate layer absorbs light. By changing the optical parameters of different layers, the system achieves both reusability and manufacturing efficiency without excessive complexity.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If UV light is used to cure the adhesive through the carrier, then attachment is achieved, but the carrier material must be transparent to UV light

Engineering Contradiction:

Improveattachment strengthVSAvoidcarrier material selection

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

Different layers of the system have different optical qualities tailored to their specific functions. The carrier is made transparent to UV light in the regions where adhesive curing is needed, while the intermediate layer is designed to absorb light for controlled detachment. This local differentiation of material properties enables both reliable attachment and carrier reuse.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient, repeatable, and damage-free attachment and detachment of wafers, facilitating precise processing and reusability of the carrier system, enhancing manufacturing efficiency.

Implementation Method 1

a UV light is directed through the transparent carrier and the partially transparent LAM layer in order to cure the UV-curable adhesive

Methodology Applied

Scientific EffectUV curing: Photopolymerisation

Implementation Method 2

a light pulse is sent from a flashlamp through the transparent carrier to detach the wafer from the transparent carrier

Methodology Applied

Scientific EffectLight absorption and heating: Absorption (EM radiation)

Implementation Method 3

a light pulse is sent from a flashlamp through the transparent carrier to detach the wafer from the transparent carrier

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20250289215A1Method for attaching and detaching wafers during integrated circuit manufacturing

Publication Date: 2025.09.18 PULSEFORGE INC

AI summary

A method for attaching and detaching wafers during integrated circuit manufacturing is disclosed. Initially, a reusable carrier is formed by depositing a layer of partially transparent light-absorbing material (LAM) on a transparent carrier. An ultraviolet (UV) curable adhesive is deposited on a wafer. The wafer is then placed on the reusable carrier with the partially transparent LAM layer in contact with the UV-curable adhesive to form a carrier stack. Next, an UV light is directed through the transparent carrier and the partially transparent LAM layer in order to cure the UV-curable adhesive. After the wafer has been processed, a light pulse is sent from a flashlamp through the transparent carrier in order to detach the wafer from the transparent carrier.