Wafer Cassette Housing With Fluid-Based Temperature Control
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Solution Overview
Problem
Existing semiconductor wafer storage systems face challenges in efficiently managing the temperature of nonvolatile memory chips within semiconductor wafers, particularly in high-capacity storage systems that require precise temperature control for optimal performance and longevity.
Innovation Solution
The implementation of a cassette housing system that utilizes heat transfer fluid to circulate temperature-regulating fluid within the cassette housing, prober, and server rack, allowing for temperature adjustment of both the probe card and semiconductor wafer, combined with thermal conduction using insulating members in the third embodiment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat transfer fluid is introduced into the cassette housing to control temperature, then temperature management capability is improved, but device complexity increases due to additional fluid circulation systems
Solution Approach 1:
The patent implements nesting by placing the heat transfer fluid circulation system within the cassette housing structure. The fluid channels are integrated into the housing walls, and the probe card assembly is positioned within the fluid-containing chamber, creating a nested configuration where the temperature control system is embedded within the storage housing without requiring separate external cooling apparatus.
Solution Approach 2:
The heat transfer fluid circulation system serves multiple functions: it cools the semiconductor wafer during storage, cools the probe card during probing operations, and can be integrated with the server rack's overall cooling system. This multi-functionality reduces the need for separate cooling systems for different components, thereby managing complexity while improving temperature control.
2Reliability
If the probe card and semiconductor wafer are both subjected to temperature control, then operational reliability is improved, but the system requires more complex thermal management infrastructure
Solution Approach 1:
The patent merges the temperature control systems for the probe card and semiconductor wafer into a single integrated heat transfer fluid circulation system. Both components are positioned within the same fluid-containing chamber, allowing a single fluid circulation loop to simultaneously cool both the probe card substrate and the semiconductor wafer, thereby improving reliability while avoiding the complexity of separate cooling systems.
3Quantity of substance
If high-capacity storage with multiple semiconductor wafers is implemented, then storage capacity is improved, but temperature uniformity across all wafers becomes difficult to maintain
Solution Approach 1:
The patent employs hydraulic principles by using a liquid heat transfer fluid that circulates through channels in the cassette housing. The fluid acts as a thermal medium that can uniformly distribute heat away from multiple semiconductor wafers stored in the cassette. The hydraulic circulation system ensures consistent heat transfer across all wafer positions, maintaining temperature uniformity even in high-capacity storage configurations with multiple wafers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective temperature management of semiconductor wafers with nonvolatile memory chips, enhancing storage system performance and chip longevity by maintaining optimal operating conditions.
Implementation Method 1
The container contains heat transfer fluid for lowering or raising temperature of one or both of the probe card and the semiconductor wafer stored in the storage unit
Implementation Method 2
combined with thermal conduction using insulating members in the third embodiment
Data Source
AI summary
According to one embodiment, a cassette housing includes a storage unit, a probe card, and a container. The storage unit stores a semiconductor wafer including a plurality of nonvolatile memory chips. The probe card includes a probe. The probe is configured to be brought into contact with a pad electrode provided on the semiconductor wafer. The container contains heat transfer fluid for lowering or raising temperature of one or both of the probe card and the semiconductor wafer stored in the storage unit.