Wafer Cassette Optical Placement Detection Through Groove Gaps
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Solution Overview
Problem
Manual detection of wafer placement in a wafer cassette is inefficient and inaccurate, especially when the cassette and cover are opaque, requiring high-intensity light that can harm workers and making it difficult to verify the correct quantity and position of wafers.
Innovation Solution
A method and device using a light source and camera system to capture images of wafer placement through gaps between wafers and diaphragms, allowing for automated detection and verification of wafer quantity and position, even in opaque cassettes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual detection method is used to check wafer placement, then workers can directly observe the wafers, but the detection efficiency and accuracy are low
Solution Approach 1:
The patent replaces the manual mechanical inspection system with an automated optical detection system. A light source illuminates the wafer cassette from below, and a camera captures images of the wafer placement status through the transparent bottom surface, enabling automated detection that improves both efficiency and accuracy simultaneously
Solution Approach 2:
The patent creates an optical copy (image) of the wafer placement status by capturing light transmitted through the wafer cassette. The camera records the position and quantity of wafers as an image that can be analyzed automatically, replacing direct manual observation with image-based detection
2Illumination intensity
If light intensity of the ambient environment is increased to show wafer placement clearly, then visibility improves, but it may cause eye damage to workers
Solution Approach 1:
The patent introduces a camera as an intermediary device between the light source and the observer. The camera captures the image of wafer placement under controlled lighting conditions and transmits it to a display device, allowing workers to view the results without being exposed to high-intensity light directly
Solution Approach 2:
The patent creates a visual copy of the wafer placement status that can be viewed on a display device. Workers observe the captured image rather than looking directly at the illuminated wafer cassette, eliminating eye damage risk while maintaining clear visibility of wafer positions
3Object-affected harmful factors
If the wafer cassette and cover are opaque, then protection is provided, but wafers cannot be seen for detection
Solution Approach 1:
The patent applies local transparency to the wafer cassette by making only the bottom surface transparent while keeping other parts opaque for protection. This localized transparency allows light to pass through for detection purposes while maintaining protective properties in other areas
Solution Approach 2:
The patent replaces the need for visual inspection through transparent materials with an automated optical detection system. The system uses a light source and camera to detect wafer placement through the transparent bottom surface, eliminating the need for workers to visually inspect through potentially transparent covers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves detection efficiency and accuracy, avoids eye damage from high-intensity light, and ensures correct wafer placement, enhancing product yield and worker safety.
Implementation Method 1
A method and device using a light source and camera system to capture images of wafer placement through gaps between wafers and diaphragms
Data Source
AI summary
A method and a device for detecting a placement of wafers in a wafer cassette are provided. The wafer cassette includes a plurality of receiving grooves. The receiving grooves hold and store the wafers. Light is emitted through the wafer cassette. The light passes through the gaps and is imaged, and the image is captured. Characteristic information is extracted from the image. The extracted characteristic information is compared with standard characteristic information of a preset image, and whether a placement of all the wafers in the wafer cassette is qualified and satisfactory is determined according to a compared result.