Multi-Size Wafer Cassette Trays With Stepped Groove Structure
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Solution Overview
Problem
Conventional wafer cassettes are limited to processing wafers of a single size due to production line constraints and automation requirements, making it difficult to handle wafers of different sizes efficiently and accurately.
Innovation Solution
A wafer cassette design that incorporates multiple trays with varying groove sizes and transmission mechanisms, allowing for the handling and processing of wafers of different diameters, such as 6 inches, 8 inches, and 12 inches, within a single cassette, with control modules and display lights for operator guidance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional wafer cassette is designed to receive wafers with a uniform size, then the production line can maintain high production rate and defect-free rate, but the cassette cannot handle wafers of different sizes without resetting production parameters
Solution Approach 1:
The wafer cassette is divided into multiple wafer trays, with each tray containing grooves of different sizes. This segmentation allows different trays to accommodate different wafer sizes simultaneously, enabling the cassette to handle mixed-size wafers without requiring production line resets.
Solution Approach 2:
Each wafer tray is designed with specific groove configurations tailored to particular wafer sizes. The grooves within each tray have dimensions matched to the wafer sizes they are intended to hold, providing localized optimization for different wafer types while maintaining a unified cassette structure.
2Measurement precision
If optical equipment is redesigned to determine positions of wafers with different sizes, then accurate position detection can be achieved, but the cost and complexity of the system increases
Solution Approach 1:
The wafer trays are pre-configured with grooves of specific sizes and positions that correspond to different wafer types. This preliminary arrangement allows the optical equipment to use fixed detection parameters to accurately locate wafers, as the groove structures provide consistent reference points regardless of wafer size variations.
Data Source
AI summary
A wafer cassette includes a case, a plurality of wafer trays, and a plurality of transmission mechanisms. The wafer trays are disposed in the case. Each of the wafer trays includes a central opening, a first groove, and a second groove. The diameter of the second groove is greater than that of the first groove. A bottom surface of the second groove is higher than that of the first groove. The first and second grooves surround the central opening. Each of the transmission mechanisms is connected to the corresponding wafer tray to move the wafer tray between a pick-up position and a received position. Since the wafer tray has grooves with different diameters, the wafer tray is capable of receiving wafers with different sizes.