Wafer Resin Sheet Cavity Support for Reinforcing Ring Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for processing wafers with circular recessed portions and ring-shaped reinforcing portions are inefficient due to the need for frequent changes in spacers to accommodate level differences, resulting in high time and effort requirements for separating the reinforcing portion from the wafer.
Innovation Solution
A wafer processing method involving the use of first and second resin sheets to form a cavity that accommodates the level difference between the circular recessed and ring-shaped reinforcing portions, allowing for the wafer to be held on a chuck table without spacers, and enabling the formation of a separating groove for easy removal of the reinforcing portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protrusion-shaped chuck table is used to support both the circular recessed portion and the ring-shaped reinforcing portion, then the wafer can be held during separating groove formation, but the device complexity increases and requires high accuracy support to prevent chipping and cracking
Solution Approach 1:
The support function is segmented between the first resin sheet (which conforms to the circular recessed portion) and the second resin sheet (which supports the ring-shaped reinforcing portion). This segmentation allows each resin sheet to independently support its corresponding feature without requiring a complex protrusion-shaped chuck table, thereby reducing device complexity while maintaining reliability
Solution Approach 2:
The first and second resin sheets act as intermediary elements between the wafer and the chuck table. The first resin sheet fills the circular recessed portion and the second resin sheet supports the ring-shaped reinforcing portion, mediating the support function and eliminating the need for a complex protrusion-shaped chuck table structure
2Manufacturing precision
If spacers of different thicknesses are used to adjust the level difference between the circular recessed portion and the ring-shaped reinforcing portion, then the wafer can be properly supported, but the productivity decreases due to frequent spacer changes
Solution Approach 1:
The first resin sheet serves multiple functions: it conforms to the circular recessed portion, provides support, and accommodates level differences without requiring spacer changes. This universal approach eliminates the need for multiple spacer thicknesses, thereby maintaining manufacturing precision while improving productivity
Solution Approach 2:
Instead of changing spacer thickness parameters to adjust for level differences, the invention uses the first resin sheet's ability to conform to the circular recessed portion and the second resin sheet's support of the ring-shaped reinforcing portion. This parameter-free approach maintains precision while eliminating time-consuming spacer changes
Data Source
AI summary
A wafer processing method includes a first fixing step of making a first resin sheet conform to a circular recessed portion and a ring-shaped reinforcing portion of a wafer by fixing an undersurface of the wafer to the first resin sheet, after the first fixing step, a second fixing step of forming a cavity between the first resin sheet fixed to the circular recessed portion and a second resin sheet by fixing the second resin sheet to the first resin sheet fixed to the ring-shaped reinforcing portion, after the second fixing step, a holding step of holding the second resin sheet of the wafer on a chuck table, and a groove forming step of forming a separating groove for separating the circular recessed portion and the ring-shaped reinforcing portion from each other.