Wafer Center Alignment via Diameter-Based Positioning Correction
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Solution Overview
Problem
Existing substrate positioning methods for semiconductor wafers, particularly for larger sizes like 300 mm wafers, face challenges in accurately determining the center position relative to the rotating center, leading to manufacturing errors and inconsistencies due to variations in wafer diameter and size.
Innovation Solution
A substrate positioning apparatus comprising a first positioning mechanism with a first reference part contacting the substrate's side and a second positioning mechanism with a contact part that applies force and detects position information, allowing for precise alignment by measuring the substrate's diameter and calculating correction values to ensure the center coincides with the rotating center.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If substrate positioning is performed using conventional methods, then positioning can be completed, but positioning precision deteriorates due to variations in substrate diameter and size
Solution Approach 1:
The patent changes the measurement parameter from fixed reference point detection to diameter-based measurement. By measuring the actual diameter of the substrate and using this variable parameter to calculate the positioning amount, the system adapts to substrates of different sizes and maintains high positioning precision regardless of substrate variations.
Solution Approach 2:
The patent replaces conventional mechanical positioning methods with a measurement-and-calculation-based positioning system. Instead of relying on mechanical fixtures or fixed references, the system uses diameter measurement and computational determination of positioning amounts to achieve precise positioning that adapts to substrate variations.
2Manufacturing precision
If substrate diameter variations are not corrected, then positioning can be performed quickly, but manufacturing precision deteriorates due to misalignment between substrate center and rotating center
Solution Approach 1:
The patent performs preliminary measurement of the substrate diameter before positioning. By measuring the diameter in advance and pre-calculating the positioning amount based on this measurement, the system ensures that the substrate center aligns with the rotating center before processing begins, thereby achieving high manufacturing precision without excessive time loss.
Solution Approach 2:
The patent implements a feedback mechanism where the measured substrate diameter is used to determine the positioning amount. The system continuously monitors substrate dimensions and adjusts positioning accordingly, ensuring that any variations in substrate size are compensated for to maintain precise center alignment.
3Reliability
If conventional positioning methods are used, then the positioning process is simple, but reliability deteriorates due to inability to accommodate different substrate sizes
Solution Approach 1:
The patent creates a universal positioning system that can handle substrates of various sizes using the same measurement and calculation methodology. The diameter-based measurement approach and positioning amount calculation formula are universally applicable regardless of substrate dimensions, enhancing reliability across different substrate types without requiring multiple specialized positioning systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables accurate positioning of substrates of varying sizes, ensuring precise bevel processing and maintaining manufacturing quality by correcting for diameter differences and misalignments, thereby enhancing manufacturing yield.
Implementation Method 1
includes an elastic part that exerts a force in a moving direction of the first driver to the contact part
Data Source
AI summary
Disclosed is a substrate positioning apparatus capable of accurately performing positioning of a center of a circular-shape substrate with respect to a rotating shaft. The substrate positioning apparatus includes: a substrate disposing part; a first positioning mechanism including a first reference part contacting a side of the substrate; a second positioning mechanism including a second reference part contacting the side of the substrate; a first driver configured to drive the first positioning mechanism; a controller configured to control the drive of the first positioning mechanism. In particular, the second reference part contacts the substrate at a contact part and includes an elastic part that applies force in a moving direction of the first driver to the contact part and a detector that detects position information of the second positioning mechanism.