Semiconductor Wafer Chip Identification Without Ink Marking
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Solution Overview
Problem
Existing semiconductor manufacturing methods face challenges in accurately separating non-defective and defective semiconductor chips without using ink, which complicates the manufacturing process and requires management of ink drying and selection.
Innovation Solution
A method involving a data acquisition process to acquire electrical test results associated with arrangement information, a cutting process using a base point to separate semiconductor chips, and an identification process based on appearance information and test results to distinguish non-defective and defective chips, eliminating the need for ink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If ink marking technique is used to mark semiconductor chips, then positional information can be recorded, but manufacturing process complexity increases due to ink selection, drying, and removal management
Solution Approach 1:
The patent extracts the marking function from the ink application process and replaces it with a physical reference pellet structure. The reference pellet with its specific position in the non-formation region serves as the marking element, eliminating the need for ink application, drying, and removal processes while maintaining positional information recording capability.
Solution Approach 2:
The patent uses optical imaging to capture the position of the reference pellet and creates a digital map data copy of the wafer layout. This digital copy contains all positional information needed for chip separation, replacing the physical ink marks while preserving the essential information.
2Loss of information
If ink marking is used for chip identification, then chip positions can be tracked, but productivity decreases due to additional ink management steps
Solution Approach 1:
The patent removes the ink management steps (application, drying, removal) from the manufacturing process by using a permanent physical reference pellet. This extraction of the marking function to a structural element eliminates time-consuming ink management operations and improves manufacturing efficiency.
Solution Approach 2:
The reference pellet is pre-positioned in the non-formation region during wafer fabrication, before any testing or marking operations. This preliminary placement of the reference structure eliminates the need for subsequent ink application steps, streamlining the process and improving productivity.
3Loss of information
If ink is applied for marking purposes, then chip locations can be recorded, but reliability decreases due to ink drying and detachment issues
Solution Approach 1:
The patent extracts the marking function from temporary ink application and relocates it to a permanent physical reference pellet that is part of the wafer structure. This reference pellet does not suffer from drying or detachment issues, ensuring reliable and stable positional information throughout the manufacturing process.
Solution Approach 2:
The reference pellet serves its marking function inherently through its physical presence and position on the wafer. It does not require external ink application or maintenance, and its positional information remains stable without requiring drying or protection from detachment, improving reliability.
Data Source
AI summary
Acquired in a data acquisition process is a test result of an electrical test performed on a plurality of semiconductor chips. The test result is associated with arrangement information of the plurality of semiconductor chips. In a cutting process, a semiconductor wafer is cut based on a base point set in the semiconductor wafer. Identified in an identification process is a non-defective semiconductor chip or a defective semiconductor chip in a semiconductor wafer on which cutting processing has been performed based on appearance information of the semiconductor wafer on which the cutting processing has been performed and the test result of the semiconductor wafer before the cutting processing. The semiconductor wafer on which the cutting processing has been performed includes two or more semiconductor chips. The appearance information is an image of a region including the base point.