Wafer Chuck Cleaning Cap for In-Situ Residue Removal
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Solution Overview
Problem
Wafer chucks in semiconductor device manufacturing become contaminated with residues and particulate matter, leading to yield and reliability issues and requiring frequent cleaning, which results in loss of productivity and increased costs.
Innovation Solution
A cleaning cap with rollers and a cleaning cloth system that moves between rollers to scrub the wafer chuck, optionally with a solvent disperser and brush, to effectively remove contaminants without interrupting the operation of the processing device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wafer chuck is removed from service for cleaning, then the chuck can be thoroughly cleaned, but productivity is lost and costs increase
Solution Approach 1:
The cleaning system performs preliminary cleaning actions during wafer processing intervals, preventing contamination buildup rather than addressing it after complete contamination occurs. The cleaning cap and rollers continuously or periodically clean the chuck surface during manufacturing cycles, eliminating the need to stop production for cleaning.
Solution Approach 2:
The cleaning operation continues alongside manufacturing operations rather than interrupting them. The cleaning cap remains in position during wafer processing, and the rollers continuously contact the chuck surface to maintain cleanliness without breaking the manufacturing workflow.
2Reliability
If frequent cleaning is performed, then contamination is reduced, but downtime increases and costs increase
Solution Approach 1:
The cleaning system is self-contained and operates autonomously within the processing chamber. The manipulator automatically positions the cleaning cap, and the rollers self-generate cleaning action through their rotation against the chuck surface, eliminating the need for external cleaning interventions and associated downtime.
Solution Approach 2:
The system performs preliminary cleaning during processing intervals, preventing contamination from reaching levels that would require complete cleaning cycles. This proactive approach maintains yield without requiring dedicated cleaning time.
3Productivity
If a cleaning system is integrated into the processing chamber, then in-situ cleaning is enabled, but device complexity increases
Solution Approach 1:
The cleaning cap serves multiple functions: it provides structural support for the rollers, acts as a cleaning platform, and can be positioned by the existing manipulator system. The rollers both rotate to create cleaning motion and apply pressure to the chuck surface, combining multiple cleaning actions in a single component assembly.
Solution Approach 2:
The manipulator serves as an intermediary that already exists in the system, used for both wafer handling and cleaning cap positioning. This existing component mediates between the control system and the cleaning mechanism, avoiding the need for dedicated cleaning actuation systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaning cap efficiently removes contaminants from the wafer chuck, reducing the need for frequent chamber or machine downtime and maintaining productivity while minimizing costs.
Implementation Method 1
A cleaning cap with rollers and a cleaning cloth system that moves between rollers to scrub the wafer chuck surface
Data Source
AI summary
A wafer chuck is cleaned using a cleaning cap to remove processing residue and particulate matter. The cleaning cap is configured to overlie and align with the wafer chuck and includes a base and a first roller connected to the base and having wound therearound a cleaning cloth. The cleaning cap further includes a second roller connected to the base and having attached thereto a free end of the cleaning cloth. During use, the cleaning cloth winds upon the second roller from the first roller when the second roller rotates about its axis. The cleaning cap can be positioned relative the wafer chuck by way of a manipulator to ensure the cleaning cloth contacts the wafer chuck with sufficient force. The cleaning cloth rubs the wafer chuck with both translational motion and rotational motion.