Wafer Chuck Cleaning Cap with Roller Cloth Mechanism
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Solution Overview
Problem
Wafer chucks in semiconductor device manufacturing become contaminated with residues and particulate matter, leading to yield and reliability issues and requiring frequent cleaning, which results in productivity loss and increased costs.
Innovation Solution
A cleaning cap with rollers and a cleaning cloth system that moves between rollers to scrub the wafer chuck surface, optionally with solvent dispensers and brushes, ensuring thorough cleaning without interfering with the operation of the processing device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wafer chuck is removed from service for cleaning, then the chuck contamination is eliminated, but the productivity is reduced due to chamber or machine downtime
Solution Approach 1:
The cleaning system performs cleaning operations continuously during wafer processing without requiring removal of the chuck from service. The cleaning cap and cloth system proactively removes contaminants as they accumulate, preventing the need for interruptive cleaning cycles and maintaining both cleanliness and productivity
Solution Approach 2:
The cleaning operation runs continuously alongside wafer processing operations. The cleaning cap rotates with the chuck and the cleaning cloth continuously contacts the chuck surface during normal operation, eliminating downtime by making cleaning a continuous rather than periodic interruptive action
2Reliability
If the wafer chuck is cleaned frequently to maintain cleanliness, then the yield and reliability are improved, but the productivity loss and costs increase due to repeated downtime
Solution Approach 1:
The cleaning system is self-contained and automatically performs cleaning operations during normal wafer processing. The cleaning cap with integrated cloth and solvent disperser cleans the chuck without external intervention or chamber interruption, eliminating the need for scheduled maintenance downtime while maintaining yield through continuous cleanliness
3Object-affected harmful factors
If a cleaning system is introduced to clean the wafer chuck, then the contamination is removed, but the device complexity increases
Solution Approach 1:
The cleaning cap serves multiple functions: it holds the cleaning cloth, receives solvent from the disperser, rotates with the chuck, and applies cleaning pressure. This multi-functional design consolidates what could be separate complex systems into a single integrated component, reducing overall device complexity while effectively removing contamination
Solution Approach 2:
The cleaning cloth is wound around a spool that is nested within the cleaning cap. The solvent disperser is integrated into the cap structure. This nested arrangement compactly packages the cleaning system components within the existing chuck volume without adding external complexity or requiring additional space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaning cap effectively reduces contamination and minimizes downtime by allowing for in-situ cleaning of the wafer chuck, maintaining productivity and reducing costs associated with frequent chamber maintenance.
Implementation Method 1
A cleaning cap with rollers and a cleaning cloth system that moves between rollers to scrub the wafer chuck
Implementation Method 2
optionally with a solvent disperser and brush, to effectively remove contaminants
Data Source
AI summary
A wafer chuck is cleaned using a cleaning cap to remove processing residue and particulate matter. The cleaning cap is configured to overlie and align with the wafer chuck and includes a base and a first roller connected to the base and having wound therearound a cleaning cloth. The cleaning cap further includes a second roller connected to the base and having attached thereto a free end of the cleaning cloth. During use, the cleaning cloth winds upon the second roller from the first roller when the second roller rotates about its axis. The cleaning cap can be positioned relative the wafer chuck by way of a manipulator to ensure the cleaning cloth contacts the wafer chuck with sufficient force. The cleaning cloth rubs the wafer chuck with both translational motion and rotational motion.