Wafer Chuck Reshaping for Full-Coverage Semiconductor Puddle Processing
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Solution Overview
Problem
Conventional puddle processes on semiconductor substrates face challenges in maintaining complete chemical coverage due to low surface tension and beveled edges, leading to processing liquid spillage over the substrate edge, which affects process performance.
Innovation Solution
The implementation of wafer chuck designs that reshape the substrate surface to be concave or flat, ensuring the processing liquid forms a puddle that covers the entire surface and prevents spillage by activating the chuck with vacuum pressure or electrostatic charge to clamp the backside center region and elevate the peripheral edge region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If a puddle process is used to reduce liquid consumption, then liquid usage is reduced, but complete chemical coverage is difficult to maintain due to spillage
Solution Approach 1:
The patent applies curvature by reshaping the substrate surface from flat to concave using the wafer chuck. The concave shape creates a curved surface that naturally retains the processing liquid in a puddle form, preventing spillage over the edges while maintaining complete chemical coverage across the active area.
Solution Approach 2:
The patent changes the surface geometry parameter of the substrate from flat to concave by adjusting the wafer chuck configuration. This parameter change transforms the surface shape to better retain the processing liquid, ensuring both reduced liquid consumption and complete chemical coverage.
2Ease of manufacture
If the substrate surface is flat, then manufacturing is simple, but processing liquid spills over the edge during puddle process
Solution Approach 1:
The patent introduces curvature to the substrate surface by using a concave shape created through wafer chuck reshaping. This curved surface configuration prevents liquid spillage during the puddle process while maintaining ease of manufacture through the use of standard wafer chuck mechanisms.
3Reliability
If the wafer chuck reshapes the substrate to concave, then liquid retention is improved, but device complexity increases
Solution Approach 1:
The patent changes the surface geometry parameter of the substrate from flat to concave by adjusting the wafer chuck configuration. This parameter change transforms the surface shape to better retain the processing liquid, ensuring both reduced liquid consumption and complete chemical coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures complete chemical coverage and retention of the puddle on the substrate surface during puddle processes, preventing spillage and enhancing process performance.
Implementation Method 1
activating the chuck with vacuum pressure or electrostatic charge to clamp the backside center region
Implementation Method 2
activating the chuck with vacuum pressure or electrostatic charge to clamp the backside center region
Data Source
AI summary
Improved wafer chuck designs, wet processing systems using such wafer chuck designs and methods are provided herein for retaining a processing liquid on a surface of a semiconductor substrate during a puddle process. More specifically, the present disclosure provides various embodiments of wafer chucks that reshape a surface of a semiconductor substrate to ensure that the substrate surface is concave (or completely flat) before a processing liquid is dispensed onto the substrate surface to form a puddle of the processing liquid on the substrate surface. By providing the substrate surface with a concave (or completely flat) shape, the embodiments disclosed herein provide complete chemical coverage across the substrate surface during a puddle process, retain the puddle on the substrate surface and prevent the puddle from spilling over the substrate edge.