Wafer Chuck Gap Modulation for Faster Die Cleaning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wafer processing apparatuses face challenges in effectively removing foreign materials from gaps between dies during cleaning, require complex structures for sealing ring installation, and suffer from increased manufacturing costs due to cumbersome coupling processes and potential structural damage from solution infiltration.
Innovation Solution
A wafer processing apparatus with a rotating chuck, vacuum chuck, and moving module that increases gaps between dies by moving the vacuum chuck or chuck module, using mechanisms like cylinders or solenoids to facilitate efficient cleaning and etching, while simplifying the structure through integrated modules for fixing and sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the cleaning time is extended to remove foreign materials from gaps between dies, then cleaning performance is improved, but processing time is increased
Solution Approach 1:
The wafer processing apparatus dynamically adjusts the gap between adjacent dies during the cleaning process. The moving module varies the gap width according to a predetermined pattern, creating dynamic fluid flow patterns that enhance cleaning effectiveness in the gap regions without requiring extended processing time.
Solution Approach 2:
The gap between dies is periodically varied during cleaning through the moving module's operation. This periodic variation in gap width creates corresponding periodic fluid flow patterns that systematically address foreign material removal from different gap regions, improving cleaning performance within normal processing time limits.
2Reliability
If a sealing ring is coupled to the rotating table to prevent solution infiltration, then structural protection is improved, but device complexity is increased
Solution Approach 1:
The sealing ring coupling mechanism is merged with the rotating table structure itself. The coupling protrusion and coupling groove are integrated into the rotating table and sealing ring respectively, eliminating the need for separate coupling mechanisms and reducing overall device complexity while maintaining structural protection.
Solution Approach 2:
The sealing ring and rotating table perform their own coupling function through their inherent structural features (coupling protrusion and coupling groove). This self-coupling mechanism eliminates the need for additional coupling devices or complex assembly procedures, reducing device complexity while ensuring proper sealing.
3Manufacturing precision
If a wafer fixing module and sealing ring fixing module are installed to prevent position variation, then positioning accuracy is improved, but device complexity is increased
Solution Approach 1:
The wafer fixing function and sealing ring fixing function are merged into a single integrated fixing module. This module simultaneously performs both fixing operations, reducing the number of separate components and simplifying the overall device structure while maintaining positioning accuracy.
Solution Approach 2:
The fixing module is designed with multi-functionality, capable of fixing both the wafer and the sealing ring through its structural features. This universal fixing capability eliminates the need for separate fixing modules, reducing device complexity while ensuring accurate positioning of both components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cleaning performance, reduces processing time, and minimizes structural damage by effectively removing foreign materials and simplifying the apparatus design, thereby improving processing efficiency and reducing defects.
Implementation Method 1
a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated
Data Source
AI summary
A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.