Wafer Chuck Gas Cooling for Uniform Prober Temperature
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Solution Overview
Problem
As wafers become larger and more highly integrated, the heat generated during electrical testing exceeds set temperatures, leading to uneven heat distribution, with the central portion of the wafer retaining more heat than the peripheral portion, necessitating efficient and localized heat removal.
Innovation Solution
A prober system with a support member featuring a first and second flow path for gases, including a jetting part to expel a second gas for heat removal and a suction part to suck the first gas, controlled by a cooling control part based on wafer temperature, effectively managing heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If additional heat removal equipment is added to remove heat from the wafer, then heat removal effectiveness is improved, but device complexity and cost increase
Solution Approach 1:
The patent uses gas flow paths (first and second flow paths) to remove heat from the wafer. The jetting part directs gas flow through the second flow path to cool high-temperature regions, while the suction part removes heated gas through the first flow path. This pneumatic approach replaces traditional large cooling equipment, achieving effective heat removal without increasing device complexity or cost.
2Temperature
If coolants are used to remove heat, then heat removal capability is improved, but the risk of coolant boiling in high-temperature environment increases
Solution Approach 1:
The patent replaces liquid coolants with gas flow paths for heat removal. The jetting part supplies gas through the second flow path, and the suction part removes heated gas through the first flow path. This eliminates the risk of coolant boiling in the high-temperature testing environment (85°C or higher) while maintaining effective heat removal capability.
3Temperature
If uniform cooling is applied across the wafer, then overall temperature control is improved, but local heat accumulation at the central portion cannot be effectively addressed
Solution Approach 1:
The patent implements localized cooling by providing a second flow path that targets the central portion of the wafer where heat accumulates. The jetting part directs gas flow specifically through this region, while the first flow path handles overall temperature control. This local quality approach effectively addresses the heat accumulation problem at the central portion while maintaining overall temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently removes heat from the wafer by jetting or sucking gases based on temperature conditions, maintaining uniform temperature across the wafer and reducing the need for additional large equipment, thus optimizing testing efficiency and cost-effectiveness.
Implementation Method 1
a jetting part that causes a second gas to jet out toward the second flow path
Implementation Method 2
a suction part that sucks the first gas from the second flow path
Implementation Method 3
a support member that supports a wafer and includes a first flow path through which a first gas passes and a second flow path merging with the first flow path
Data Source
AI summary
A prober includes a wafer chuck that is a support member for supporting a wafer, a test part that tests electrical characteristics of semiconductor devices formed on a wafer when the wafer is placed on the wafer chuck, a jetting part that sends air to an air purge line connected to a chuck space formed in the wafer chuck, and a cooling control part that determines whether or not to cause the air to jet out.