Vacuum Wafer Chuck Lifting Assembly for Reliable Substrate Handling
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Solution Overview
Problem
Mechanical failures in substrate lifting and moving mechanisms in semiconductor processing stations lead to reduced manufacturing yield due to inefficiencies in existing technologies.
Innovation Solution
A substrate displacing assembly with a pair of load forks, a coupler, and a driving shaft, which allows for controlled lifting and moving of substrates using a linear motor and ball screw mechanism, enhancing reliability and reducing mechanical failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing substrate lifting and moving mechanisms are used, then substrate handling is performed, but mechanical failures occur frequently reducing manufacturing yield
Solution Approach 1:
The substrate handling system is divided into separate functional modules: a substrate holder with multiple pins for gripping, a displacing assembly with load forks for lifting, and a driving mechanism with ball screws for controlled movement. This segmentation allows each component to be optimized independently and reduces the propagation of mechanical failures across the entire system.
Solution Approach 2:
The substrate holder employs multiple retractable pins that can dynamically adjust their position and engagement force. The displacing assembly uses movable load forks that can adapt to substrate thickness variations. This dynamic capability enhances reliability by allowing the system to accommodate real-time variations without mechanical failure.
2Productivity
If existing substrate handling mechanisms are used, then substrate transport is achieved, but mechanical failures lead to reduced manufacturing yield
Solution Approach 1:
The invention replaces traditional belt-driven or gear-based mechanical transmission systems with a ball screw mechanism driven by a linear motor. This substitution eliminates complex mechanical linkages that are prone to failure, reducing the mechanical failure rate while maintaining precise control over substrate displacement for high manufacturing yield.
Solution Approach 2:
The load forks act as an intermediary component between the driving mechanism and the substrate holder. They transfer the driving force through the pins to the substrate while providing mechanical advantage and isolation, reducing stress on critical components and minimizing the likelihood of mechanical failures that would affect manufacturing yield.
3Reliability
If traditional substrate handling mechanisms are used, then substrate movement is performed, but frequent mechanical failures occur
Solution Approach 1:
The invention extracts and eliminates complex intermediate transmission components (belts, gears, couplings) from the substrate handling mechanism. By using a ball screw mechanism directly coupled to a linear motor, the design achieves reliable substrate lifting with fewer moving parts, reducing both mechanical failure points and overall device complexity.
Solution Approach 2:
The displacing assembly is designed as a universal mechanism that can handle substrates of varying sizes and thicknesses through its load forks and multiple pins. This multi-functionality is achieved without adding complexity, as the same basic mechanism adapts to different substrate types, maintaining reliability while avoiding the need for multiple specialized mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability of substrate handling in semiconductor processing stations, reducing mechanical failures and enhancing manufacturing yield by providing precise control over substrate displacement.
Implementation Method 1
A vacuum chuck is configured with a bottom surface facing the chamber and a top surface facing the substrate holder. The vacuum chuck is operative to hold the semiconductor wafer against the top surface of the substrate holder.
Implementation Method 2
The cooling element is configured in thermal communication with a back surface of the wafer opposite the front surface. The cooling element is operative to reduce a temperature of the wafer.
Data Source
AI summary
Disclosed is a substrate displacing assembly so as to improve its durability during a semiconductor processing. In one embodiment, a semiconductor manufacturing system, includes, a substrate holder, wherein the substrate holder is configured with a plurality of pins; and a substrate displacing assembly for displacing a substrate on the substrate holder in a first direction perpendicular to the top surface of the substrate holder through the plurality of pins, wherein the substrate displacing assembly comprises a pair of load forks, a coupler and a driving shaft, wherein the pair of load forks comprises a fork region and a base region, wherein the coupler is mechanically coupled to the base region through at least one first joining screw extending in the first direction, wherein the coupler is further mechanically coupled to the driving shaft through a second joining screw extending in the first direction.