Wafer Chuck Drive Control for Abnormal Motion Detection

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Solution Overview

Problem

Existing technologies fail to recognize and prevent the breakage of wafers and probes due to abnormal operations of the movement mechanism in semiconductor chip inspection, leading to unnecessary damage and high costs.

Innovation Solution

A drive control device and method that includes an operation instruction transmission unit, information acquisition unit, analysis unit, and determination unit to detect position deviations and determine the occurrence of abnormal operations in the movement mechanism, allowing for proactive prevention of wafer and probe damage by separating them when abnormalities are detected.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the wafer and probe are aligned and contacted to stop for measurement, then measurement precision is improved, but the risk of unintentional breakage increases

Engineering Contradiction:

Improvemeasurement precisionVSAvoidbreakage risk

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The system performs preliminary monitoring of position deviations during the alignment and contact process. By continuously acquiring position deviation information between the wafer chuck and probe, the system can detect abnormalities before they lead to breakage, allowing preventive actions to be taken in advance.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system implements a feedback mechanism by continuously monitoring position deviation information and comparing it against predetermined thresholds. When deviations exceed thresholds, the system provides feedback to determine abnormal operations and trigger protective actions, creating a closed-loop control system that prevents breakage while maintaining measurement precision.

Inventive Principle:

Principle #23Feedback

2Productivity

If the movement mechanism operates to align wafer and probe, then productivity is improved, but the occurrence of abnormal operation increases

Engineering Contradiction:

ImproveproductivityVSAvoidabnormal operation occurrence

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The system continuously monitors position deviation information during movement operations and provides real-time feedback. By comparing actual positions against operation instructions, the system can detect abnormal operations immediately and trigger protective actions, maintaining both productivity and reliability.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The system replaces purely mechanical alignment operations with a controlled process that incorporates sensor-based position detection and electronic control. By substituting mechanical trust with electronic monitoring and control, the system maintains productivity while reducing abnormal operations through precise, monitored movement.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If position deviation monitoring is implemented to detect abnormal operations, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improveabnormal operation detectionVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The system introduces position deviation information as an intermediary element that mediates between the movement mechanism and the control system. This intermediary provides a simple, quantifiable metric for detecting abnormalities without requiring complex monitoring equipment, thereby improving reliability while minimizing added complexity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The system monitors changes in position deviation parameters to detect abnormal operations. By focusing on parameter changes rather than absolute positions, the system can identify abnormalities using simple threshold comparisons, improving reliability through ease of implementation rather than complex analysis.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS12449474B2Drive control device, drive control method, program and prober

Publication Date: 2025.10.21 TOKYO SEIMITSU CO LTD

AI summary

A drive control device including an operation instruction transmission unit configured to transmit an operation instruction to a motor driving device for operating a movement mechanism of a wafer chuck; an information acquisition unit (62) configured to acquire a position deviation information including a position deviation at an actual position of the wafer chuck with respect to a position of the wafer chuck in the operation instruction; an analysis unit (64) configured to analyze the position deviation information; and a determination unit configured to determine an existence or absence of an occurrence of an abnormal operation of the movement mechanism based on an analysis result of the position deviation information can suppress a breakage of the wafer or the like in a state that the wafer and a probe are in contact with each other.