Segmented Wafer Chuck Heating for Uniform Plasma Processing
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Solution Overview
Problem
Existing plasma processing apparatuses face challenges in achieving high processing accuracy and yield due to insufficient consideration of temperature control, leading to increased costs and performance degradation from the large number of temperature sensors and heaters required.
Innovation Solution
A plasma processing apparatus with a sample stand having a cylindrical shape, featuring plural heaters arranged in three or more radial regions, including a circular region and ring-like regions, and fewer temperature sensors than heaters, with a control unit adjusting the heaters' output based on temperature sensor feedback to maintain a target temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a large number of temperature sensors and heaters are arranged on the sample stand to precisely control temperature, then manufacturing precision and reliability improve, but device complexity and cost increase
Solution Approach 1:
The sample stand is divided into multiple radial regions (center, intermediate, and peripheral regions) with heaters and temperature sensors arranged in specific patterns within these segments. This segmentation allows precise temperature control in different zones while reducing the total number of components compared to uniform distribution
Solution Approach 2:
The sample stand structure serves multiple functions: it supports the wafer, provides heating through integrated heaters, monitors temperature via sensors, and maintains mechanical stability. This multi-functionality reduces the need for separate components, thereby reducing device complexity while maintaining temperature control precision
2Manufacturing precision
If multiple heaters are arranged in different radial regions to control temperature distribution, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
Different radial regions of the sample stand are equipped with heaters based on their specific thermal requirements. The center, intermediate, and peripheral regions each have heaters strategically positioned to address local temperature control needs, optimizing temperature distribution without uniformly heating the entire sample stand
Solution Approach 2:
The heater outputs are dynamically adjusted based on feedback from temperature sensors in different radial regions. This dynamic control allows the system to adapt to changing thermal conditions during processing, maintaining precise temperature distribution while using a manageable number of heaters
3Manufacturing precision
If temperature control is enhanced to improve processing accuracy, then manufacturing precision improves, but the number of components increases leading to higher cost
Solution Approach 1:
Temperature sensors are positioned to detect temperature conditions before they significantly deviate from target values, allowing the control system to make preliminary adjustments to heater outputs. This preventive approach maintains processing accuracy while reducing the need for excessive sensing and correction components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the yield of wafer processing by reducing temperature variation on the sample stand, enhancing processing accuracy, and reducing costs by minimizing the number of temperature sensors and heaters.
Implementation Method 1
a heater arranged in a center part and plural ring-like regions surrounding the center part on the outer peripheral side when viewed from above a sample stand... plural heaters are arranged in respective arc-like zones divided in the circumferential direction around the center of the sample stand having a cylindrical shape in the ring-like regions
Implementation Method 2
plural temperature sensors which are arranged inside the sample stand under the respective regions in the radial direction and the number of which is smaller than that of heaters
Data Source
AI summary
A plasma processing apparatus or method that improves the yield of wafer processing, including a sample stand on which the wafer is mounted; plural heaters which are arranged in three or more regions in the radial direction including a circular region concentrically arranged around the center and ring-like regions surrounding the outer periphery on plural radii in the radial direction from the center toward the outer peripheral side, and which include one arranged in each of plural arc-like regions divided in the circumferential direction around the center of at least one of the ring-like regions; plural temperature sensors arranged in the radial direction and the number of which is smaller than that of heaters; and a control unit which adjusts the output of each of the plural heaters according to the output from the temperature sensor so that the temperature of the sample stand becomes closer to a target value.