Wafer Chuck Structured Surface to Prevent Dicing Tape Adhesion
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Solution Overview
Problem
The dicing tape used in laser beam wafer dicing often sticks to the wafer support plate of the chuck, leading to chuck contamination, die-knocking, and damage to the chuck surface due to the laser beam.
Innovation Solution
A chuck with a topographically structured surface region on its upper surface, which overlaps the wafer edge and reduces the contact area with the dicing tape, thereby minimizing contamination and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the laser beam is used to cut the wafer into dies, then the wafer is separated into individual dies, but the dicing tape sticks to the wafer support plate in the area outside the wafer edge causing chuck contamination and damage
Solution Approach 1:
The wafer support plate is designed with a topographically structured surface region that creates a non-stick zone specifically in the area where the laser beam acts on the dicing tape. This localized surface modification (elevated structures, grooves, or patterns) prevents tape adhesion only in the critical overcut region while maintaining normal support functionality elsewhere, thus resolving the contradiction between efficient laser dicing and chuck contamination prevention
Solution Approach 2:
The topographically structured surface region acts as an intermediary between the dicing tape and the wafer support plate. This intermediate structure modifies the interaction interface by creating physical barriers (elevations, grooves, or patterns) that prevent direct contact and adhesion between the tape and plate in the laser exposure area, thereby preventing contamination while allowing the laser dicing process to proceed efficiently
2Reliability
If chemical cleaning and high temperature cleaning are used to remove tape residue, then the chuck is cleaned, but the cleaning cost increases significantly
Solution Approach 1:
The topographically structured surface region is prepared in advance on the wafer support plate to create a non-stick surface geometry. This preliminary structural modification prevents tape residue adhesion before the dicing process completes, eliminating the need for subsequent costly chemical or high-temperature cleaning operations while maintaining chuck cleanliness and reliability
3Object-affected harmful factors
If the dicing tape contact area with the chuck is reduced, then contamination and damage are prevented, but the tape may not be held securely during the dicing process
Solution Approach 1:
The wafer support plate features a topographically structured surface region with elevated structures, grooves, or patterns that create a non-stick zone specifically in the laser exposure area while maintaining adequate contact area in regions where secure holding is required. This localized differentiation resolves the contradiction by preventing contamination where needed while preserving holding strength where required
Solution Approach 2:
The surface of the wafer support plate is segmented into different functional zones: a topographically structured non-stick region in the overcut area where the laser beam acts, and normal contact regions elsewhere. This segmentation allows the plate to simultaneously provide secure holding in some areas and contamination prevention in others, resolving the contradiction between tape adhesion and contamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structured surface region reduces the area of contact between the chuck and the dicing tape, extending the cleaning interval of the chuck, preventing contamination and damage, and facilitating easier wafer lift-off.
Implementation Method 1
The topographically structured surface region provides for a reduction in the area of contact between the upper surface and the dicing tape
Data Source
AI summary
A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes a topographically structured surface region that partly or completely overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The topographically structured surface region provides for a reduction in an area of contact between the upper surface and the dicing tape.