Wafer Chuck Temperature Calibration Using Test Wafer Sensors
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Solution Overview
Problem
Current methods for measuring and calibrating the temperature of a wafer chuck in semiconductor processes are limited by the number of sensors, environmental deviations, and labor-intensive manual processes, leading to inaccurate temperature distribution measurements and high labor costs.
Innovation Solution
A method and system that utilize a test wafer with semiconductor devices whose electrical parameters vary with temperature, heated to set temperatures, to measure actual temperatures and distributions, and adjust the heat source accordingly for calibration, incorporating a heating module, setting module, measuring module, and calculating module to obtain accurate temperature distributions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature calibrators are placed at each position on the device stage to measure and calibrate temperature, then temperature distribution can be measured, but the method is labor-intensive and time-consuming
Solution Approach 1:
The patent uses semiconductor devices formed on the wafer as temperature sensors, copying the temperature measurement function from external temperature calibrators to the wafer itself. This eliminates the need for separate calibration devices and manual measurements, significantly reducing calibration time while maintaining measurement accuracy through the electrical parameter variations of the semiconductor devices with temperature
Solution Approach 2:
The wafer serves dual purposes: as the substrate for semiconductor device fabrication and as the temperature measurement platform. The semiconductor devices on the wafer self-measure their own temperature through electrical parameter variations, eliminating the need for external temperature calibrators and manual measurement processes
2Manufacturing precision
If multiple temperature calibrators are used to ensure temperature consistency across the stage, then temperature uniformity can be achieved, but the device complexity and cost increase
Solution Approach 1:
The wafer performs multiple functions simultaneously: it serves as the substrate for semiconductor device fabrication, the platform for temperature measurement, and the reference for temperature calibration. This multi-functionality eliminates the need for separate temperature calibrators and complex calibration systems, reducing device complexity while maintaining temperature uniformity control
Solution Approach 2:
The patent utilizes the natural variation of electrical parameters in semiconductor devices with temperature changes to achieve temperature measurement and calibration. By monitoring electrical parameter changes (such as threshold voltage, carrier mobility) of the semiconductor devices on the wafer, the system determines temperature distribution and achieves temperature uniformity control without additional hardware
3Measurement precision
If manual temperature calibration is performed using temperature calibrators, then temperature can be measured, but labor costs are high
Solution Approach 1:
The patent replaces the mechanical manual calibration process with an automated electrical measurement system. Instead of physically placing and reading temperature calibrators, the system automatically measures electrical parameters of semiconductor devices on the wafer and converts these electrical signals into temperature information, eliminating manual labor and reducing costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach eliminates environmental influences and reduces temperature measuring deviations, improving the accuracy and efficiency of wafer chuck temperature calibration by directly measuring semiconductor device temperatures and distributing them across the wafer chuck.
Implementation Method 1
The wafer chuck is disposed on the heat source... The heating module is configured to heat the wafer chuck to set temperatures
Implementation Method 2
a plurality of semiconductor devices having electrical parameters varying as a function of temperature are formed on the test wafer... Actual temperatures of the semiconductor devices are obtained according to the electrical parameters and variations, of the electrical parameters, as the function of temperature
Data Source
AI summary
Methods for measuring a temperature of a wafer chuck and calibrating temperature and a temperature measuring system are provided. The measuring method includes: placing a test wafer on a wafer chuck, where a plurality of semiconductor devices having electrical parameters varying as a function of temperature are formed on the test wafer; making the temperature of the wafer chuck reach set temperatures; measuring the semiconductor devices respectively to obtain electrical parameters corresponding to the semiconductor devices; obtaining actual temperatures of the semiconductor devices according to the electrical parameters and variations, of the electrical parameters, as the function of temperature; and obtaining an actual temperature distribution of the wafer chuck according to the actual temperatures of the semiconductor devices.